Senior Member of Technical Staff, Thin Films Engineer
Intel Corporation
Turn this role into an interview — a resume and cover letter built around what this employer wants.
Benefits offered by this job
Job summary
Intel's MDCE team seeks a senior technical leader to drive process innovation in thin film deposition for advanced semiconductor technologies in high-volume manufacturing.
You will spearhead development, optimization, and manufacturability across CVD, ALD, PVD, epitaxy, and related processes, ensuring efficient transitions from development to production while aligning with foundry customer requirements.
Qualifications
- Master's degree in a STEM field.
Responsibilities
- Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules.
- Reduce defects and improve uniformity via process enhancements.
- Lead technical problem resolution and deliver solutions that meet aggressive technology node targets.
- Optimize equipment performance with internal teams and suppliers.
- Collaborate with Technology Development, High Volume Manufacturing, and Business Groups.
- Present technical findings to engineering teams and executives.
Skills
Education
Tools
Job description
Job Details: Job Description: Organization Overview: Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.
Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a senior technical leader driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements.
Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes.
- Process Innovation and Excellence: Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules.
- Drive defectivity reduction and uniformity improvements through systematic process enhancement.
- Lead technical problem resolution and deliver solutions that meet aggressive technology node targets.
- Optimize equipment performance working with internal teams and key suppliers.
- Strategic Technical Leadership: Align technical vision with customer requirements and business objectives.
- Synthesize complex technical data to formulate and execute strategic responses.
- Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines.
- Deliver rapid execution of innovative solutions to meet challenging development timelines.
- Cross-Functional Partnership: Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups.
- Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers.
- Present technical findings effectively to diverse audiences from engineering teams to executive leadership.
- Foster in-person collaboration to accelerate decision-making and problem resolution.
- Industry Leadership: Stay current with semiconductor industry trends and emerging process technologies.
- Drive strategic initiatives that position Intel at the forefront of manufacturing innovation.
- Contribute to technology roadmaps through hands-on technical expertise and market insight.
- Technical Excellence: Results-driven professional with exceptional technical problem-solving abilities.
- Proven track record of significant accomplishments across multiple technology nodes.
- Strong analytical skills with expertise in yield improvement, performance enhancement, and variation reduction.
- Deep understanding of semiconductor manufacturing strategies, fab operations, and technology transfer.
- Leadership Capabilities: Outstanding communication skills for presenting complex technical information to varied audiences.
- Self-motivated with strong initiative and ability to navigate ambiguous technical challenges.
- Demonstrated ability to manage multiple high-priority projects under pressure while maintaining quality focus.
- Experience driving clarity in complex technical situations and leading cross-functional initiatives.
- Industry Expertise: Comprehensive knowledge of process development, materials science, and device physics.
- Ability to interpret industry trends and translate market dynamics into actionable technical strategies.
- Experience with foundry business models and customer engagement requirements.
- Proven capability to work independently while managing diverse technical assignments.
- Minimum Qualifications: Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field.
- 5+ years semiconductor industry experience with strong focus on thin film deposition processes.
- Proven experience in process development, technical leadership, and manufacturing engineering.
- Experience working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization.
- Fab startup experience across manufacturing, quality, R and D, and supply chain functions.
- Experience with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems.
- Preferred Qualifications: Ph.D. in Electrical/ Mechanical or Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologies.
- Experience in Gate All Around (GAA) logic technologies within semiconductor foundry environments.
- Experience delivering customized solutions across Technology Development and HVM organizations.
- Cross-functional leadership experience managing diverse stakeholder groups.
- Semiconductor foundry experience.
This high-visibility position directly impacts Intel's foundry competitiveness and customer success. You will work on industry-defining technologies while building expertise that positions you as a leader in advanced semiconductor manufacturing.
This role emphasizes collaborative, in-person work to enable rapid innovation cycles and real-time problem resolution in Intel's state-of-the-art manufacturing facilities.
Join Intel's mission to push the boundaries of semiconductor manufacturing technology. Your expertise will directly influence the next generation of computing innovations and manufacturing excellence.
Experienced Hire
Shift 1 (United States of America)
US, Oregon, Hillsboro
US, Arizona, Phoenix
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.
N/A
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
$155,520.00-298,440.00 USD
This role will be eligible for our hybrid work model which allows employees to split their time between working on‑site at their assigned Intel site and off‑site. Job posting details (such as work model, location or time type) are subject to change.
Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. Intel’s official careers website.
'/%3e%3cpath%20d='M101.744%2012.4726L102.894%2016.1947L99.0021%2013.2201L101.744%2012.4726ZM105.3%208.40937H100.488L99.0026%203.59473L97.5116%208.41047L92.7%208.40385L96.5965%2011.3834L95.1055%2016.1942L99.0021%2013.2196L101.408%2011.3834L105.3%208.40992V8.40937Z'%20fill='white'/%3e%3cdefs%3e%3clinearGradient%20id='paint0_linear_5593_1381'%20x1='90'%20y1='9.44471'%20x2='99'%20y2='9.44471'%20gradientUnits='userSpaceOnUse'%3e%3cstop%20stop-color='%2300AD70'/%3e%3cstop%20offset='0.998594'%20stop-color='%2300B67A'/%3e%3cstop%20offset='1'%20stop-color='%23DCDCE6'/%3e%3c/linearGradient%3e%3c/defs%3e%3c/svg%3e){kind=small}
