Senior Thermal Simulation Engineer - Advanced Packaging

Conductor; San Jose (CA); On-site; USD 189,000 - 301,000; Full time

Benefits offered by this job

4+ weeks paid time off

Medical/Dental/Vision/401k

Annual incentive opportunities

Charitable giving match

Job summary

Samsung Semiconductor seeks a Senior Staff Engineer to lead thermal modeling and analysis for advanced semiconductor packaging. You will work with cross-functional teams to develop and optimize thermal solutions for high-performance devices.

The role emphasizes hands-on CFD, model development, and collaboration with customers and internal teams across life-cycle stages, including early feasibility and detailed design validation.

Qualifications

• PhD in Mechanical Engineering, Thermal/Fluids, or related Physical Science with 10+ years of industry experience preferred.
• Experience using CFD tools (ANSYS Icepak, Flotherm, CELSIUS) to model electronics cooling and packaging.
• Strong understanding of heat transfer, fluid mechanics, and thermal design constraints.

Responsibilities

• Lead hands-on thermal modeling and analysis for semiconductor packages and advanced packaging.
• Build and analyze detailed models using ANSYS Icepak and Siemens Flotherm; set up boundaries, run solvers, post-process.
• Influence architecture, materials selection, and structural integrity under manufacturing and test conditions.
• Analyze results to improve product reliability and support customers through development cycles.
• Translate requirements into simulation methodologies; develop standards and innovative solutions.
• Communicate findings clearly via reports, presentations, and reviews.

Skills

Thermal modeling

CFD

Cross-functional collaboration

Thermal management

Education

PhD in Mechanical Engineering / Thermal Fluids / related Physical Science

Tools

ANSYS Icepak

Flotherm

CELSIUS

Job description

Samsung Semiconductor seeks a Senior Staff Engineer to lead thermal modeling and analysis for advanced semiconductor packaging. You will work with cross-functional teams to develop and optimize thermal solutions for high-performance devices.

The role emphasizes hands-on CFD, model development, and collaboration with customers and internal teams across life-cycle stages, including early feasibility and detailed design validation.