Senior Staff Thermal Engineer: Advanced Packaging & Modeling

Engg; San Jose (CA); On-site; USD 189,000 - 301,000; Full time

Benefits offered by this job

Medical/Dental/Vision

401k

Paid time off

Fertility/adoption stipend

Medical travel support

Pet care/vet

Onsite gym and café

Flexible work environment

Job summary

Samsung Semiconductor in San Jose seeks a highly experienced Senior Staff Thermal Engineer to lead thermal modeling, analysis, and solution development for semiconductors and advanced packaging. You will collaborate with cross‑functional teams and customers to drive design validation and optimization.

The role requires deep expertise in thermal simulation, heat transfer, and electronics cooling, with hands-on CFD tool usage and strong communication skills.

Qualifications

• PhD in Mechanical Engineering, Thermal/Fluids, or related Physical Science with 10+ years of industry experience preferred.
• Experience with CFD tools listed above and electronics packaging issues.
• Ability to build models, analyze results, and propose engineering recommendations.

Responsibilities

• Lead and perform hands-on thermal modeling for semiconductor packages and advanced packaging.
• Build and analyze detailed models using CFD tools, including setup, boundary conditions, solver execution and post-processing.
• Influence architecture, materials selection, and thermal design constraints.
• Analyze simulation and measurement results to improve reliability and performance.
• Support customers throughout product development from concept to validation.
• Translate customer requirements into simulation methodologies and develop standards.

Skills

Thermal modeling

CFD tools

Heat transfer

Cross-functional collaboration

Communication skills

Independent troubleshooting

Education

PhD in Mechanical Engineering / Thermal-Fluids or related

Tools

ANSYS Icepak

Siemens Flotherm

CELSIUS

Job description

Samsung Semiconductor in San Jose seeks a highly experienced Senior Staff Thermal Engineer to lead thermal modeling, analysis, and solution development for semiconductors and advanced packaging. You will collaborate with cross‑functional teams and customers to drive design validation and optimization.

The role requires deep expertise in thermal simulation, heat transfer, and electronics cooling, with hands-on CFD tool usage and strong communication skills.