Senior Thermal/Mechanical Cloud Hardware Engineer

Socket.dev; Austin (TX); On-site; USD 159,000 - 215,000; Full time

Job summary

Annapurna Labs, an AWS organization, is seeking a Cloud Hardware Development Engineer (Thermal/Mechanical) in Austin, TX to own end-to-end thermal and mechanical design for ML/AI accelerator platforms.

You will work across silicon, firmware, and manufacturing teams to deliver high density cooling solutions, CFD/FEA models, and reliable systems at global scale. Experience leading cross-functional projects is required.

Qualifications

• BS degree in mechanical engineering or equivalent.
• 7+ years in mechanical and thermal design in electronics packaging.
• Experience with thermal measurements on SoCs/servers.
• 3+ years of SoC thermal modelling and IC package transient thermal response.
• Experience with air- and liquid-cooled systems design.
• Tolerance analysis and sheet metal/precision-machining design for electronics packaging.
• Production fleet support: telemetry, root cause analysis, mitigation strategies.
• Leadership across silicon, firmware, mechanical, and operations teams.

Responsibilities

• Own the complete thermal and mechanical design for ML/AI accelerator platforms—from rack-level to chip packaging.
• Define design targets and drive cross-functional alignment across hardware, firmware, and software.
• Deliver production platforms through the full lifecycle: concept, design, prototyping, validation, ramp, fleet operations.
• Design cooling solutions (air and liquid) for high-power-density accelerators.
• Develop CFD models, RC models, and structural FEA for thermal analysis.
• Design rack manifolds, cold plates, and data center liquid cooling interfaces.
• Own mechanical design of interconnect subsystems and serviceable interfaces.
• Perform structural FEA for shock, vibration, and transport loads.
• Lead design reviews and mentor junior engineers.

Skills

Mechanical design

Thermal design

SoC thermal modelling

Structural FEA

GD&T

Cross-functional leadership

Vendor management

CFD modelling

3D CAD

Scripting (bash/python)

Education

BS degree in mechanical engineering or equivalent

Tools

Ansys Icepak

FloTherm

Cadence Celsius

PTC Creo

Solidworks

Job description

Annapurna Labs, an AWS organization, is seeking a Cloud Hardware Development Engineer (Thermal/Mechanical) in Austin, TX to own end-to-end thermal and mechanical design for ML/AI accelerator platforms.

You will work across silicon, firmware, and manufacturing teams to deliver high density cooling solutions, CFD/FEA models, and reliable systems at global scale. Experience leading cross-functional projects is required.