Mechanical Engineer

Pegatron Technologies LLC; South Carolina; On-site; USD 70,000 - 100,000; Full time

Job summary

Pegatron Technologies LLC in Austin, TX is seeking a Mechanical Engineer (0-3 years) to design and optimize the structural and thermal solutions for high-density AI servers built on the GB3600 platform.

You will collaborate with electrical, board layout, and manufacturing teams, perform thermal testing, and use CAD tools like SolidWorks, Creo, or NX, plus FEA/CFD simulations to ensure reliability and EMI/Signal integrity.

Qualifications

• Bachelor’s degree in Mechanical Engineering, Thermal Engineering, or a closely related STEM field.
• 0 to 3 years of industry or rigorous academic/internship experience in mechanical design and thermal management (preferably in enterprise servers, data centers, or consumer electronics).
• Experience with 3D CAD modeling and basic FEA/CFD simulation tools (e.g., ANSYS, SolidWorks Flow Simulation, or Icepak).

Responsibilities

• Mechanical Design: design and 3D model server chassis, rack layouts, and structural components using CAD software (e.g., SolidWorks, Creo, or NX).
• Thermal Management: develop cooling solutions including heatsinks and air- or liquid-cooling loops for GB3600 systems.
• Prototyping & Testing: build physical prototypes and conduct airflow, thermal, and vibration testing.
• Cross-Functional Collaboration: work with electrical, board layout, and manufacturing teams to ensure designs meet EMC and signal integrity requirements.

Skills

3D CAD modeling

FEA/CFD simulation

Thermal management

Thermal design

Education

Bachelor's degree in Mechanical Engineering

Tools

SolidWorks

Creo

NX

ANSYS

Icepak

Job description

This Mechanical Engineer (0-3 years) role in Austin, TX focuses on the thermal and physical design of high-density AI servers, integrating the GB3600 architecture.

Role Overview

We are seeking a driven and innovative Mechanical Engineer to join our hardware development team. You will be responsible for designing and optimizing the structural and thermal solutions for next-generation AI/ML servers utilizing the advanced GB3600 platform. In this role, you will help tackle the extreme cooling and packaging challenges associated with high-density AI computing.

Key Responsibilities

• Mechanical Design: Assist in designing and 3D modeling server chassis, rack layouts, and structural components using CAD software (e.g., SolidWorks, Creo, or NX).
• Thermal Management: Help develop and evaluate cooling solutions—including heatsinks, air-cooling, and potentially liquid cooling loops to support high-wattage GB3600 systems.
• Prototyping & Testing: Build physical prototypes and conduct airflow, thermal, and vibration testing to validate design margins and reliability.
• Cross-Functional Collaboration: Work closely with electrical, board layout, and manufacturing teams to ensure mechanical designs meet electromagnetic compatibility (EMC) and signal integrity requirements.

Basic Qualifications

• Education: Bachelor’s degree in Mechanical Engineering, Thermal Engineering, or a closely related STEM field.
• Experience: 0 to 3 years of industry or rigorous academic/internship experience in mechanical design and thermal management (preferably in enterprise servers, data centers, or consumer electronics).
• Technical Skills: Familiarity with 3D CAD modeling and basic FEA/CFD (Finite Element Analysis / Computational Fluid Dynamics) simulation tools (e.g., ANSYS, SolidWorks Flow Simulation, or Icepak).

Preferred Qualifications

• Hands-on lab experience performing thermal and airflow characterization using thermocouples and anemometers.
• Foundational knowledge of modern GPU/accelerator server architecture.