Senior System Architect, High-Speed Data & AI Interconnects

TE Connectivity; United States; On-site; USD 150,000 - 210,000; Full time

Job summary

TE Connectivity is seeking a System Architect within the Digital Data Networks group to drive high-speed interconnect technology and next-gen compute/AI workloads. You will interface with customers to shape requirements and align TE roadmaps with industry standards.

You will lead architecture discussions, evaluate copper and optical interconnects, and collaborate across R&D, product, and business units to deliver scalable, future-proof solutions. Travel 25–30% is anticipated.

Qualifications

• Bachelor’s degree in Electrical or Mechanical Engineering (MBA a plus).
• Strong background in system-level design for datacenter, compute, networking or storage.
• Expertise with high-speed signaling, hardware, and interconnects.
• Experience with industry-standard design tools for simulation and CAD.
• Ability to communicate complex concepts to diverse audiences.

Responsibilities

• Serve as technical liaison with hyperscalers, OEMs, and system architects.
• Define high-level system architecture requirements aligned with roadmaps.
• Drive technology strategy for PCIe, CXL, Ethernet, InfiniBand, and AI workloads.
• Lead evaluation of high-speed interconnect solutions balancing performance and cost.

Skills

Electrical engineering

System-level design

High-speed interconnects

Compute/Networking/AI-ML

CAD / signal integrity

Communication with customers

Travel 25-30%

Education

Bachelor's degree in Electrical or Mechanical Engineering

Tools

Simulation tools

Modeling

CAD

Signal integrity analysis

Job description

TE Connectivity is seeking a System Architect within the Digital Data Networks group to drive high-speed interconnect technology and next-gen compute/AI workloads. You will interface with customers to shape requirements and align TE roadmaps with industry standards.

You will lead architecture discussions, evaluate copper and optical interconnects, and collaborate across R&D, product, and business units to deliver scalable, future-proof solutions. Travel 25–30% is anticipated.