Senior Storage Systems Administrator (TS/SCI, Poly)

TAP Engineering; Fort Meade (MD); On-site; USD 83,000 - 158,000; Full time

Benefits offered by this job

Paid Time Off

401(k) matching

Medical coverage

Dental & Vision

Disability insurance

Tuition reimbursement

Wellness programs

Job summary

TAP Engineering is seeking System Administrators at the II and III levels to provide enterprise and HPC-focused storage sustainment in large-scale, mission-critical environments.

This role encompasses the sustainment of the entire storage environment across two geographically dispersed locations, supporting heterogeneous, multi-vendor high-performance storage platforms, mass storage subsystems, and fiber channel interconnection fabrics.

Qualifications

• Active TS/SCI clearance with Full Scope Polygraph (poly within 7 years).
• DoD 8570 IAT II certification required.
• B.S in technical discipline.
• Level II requires 5+ years with degree or 10+ without; Level III requires 10+ with degree or 15+ without.

Responsibilities

• Provide support for implementation, troubleshooting, and maintenance of IT systems.
• Support day-to-day operations, monitoring, and incident response for storage environments.
• Manage and sustain enterprise and HPC storage systems.
• Provide Tier 1 and Tier 2 support based on experience level.
• Escalate issues appropriately to Government and internal stakeholders.
• Document system configurations, procedures, and sustainment activities.

Skills

Troubleshooting

Documentation

Verbal communication

Written communication

Education

B.S in technical discipline

Tools

Linux

Unix

Windows

Job description

TAP Engineering is seeking System Administrators at the II and III levels to provide enterprise and HPC-focused storage sustainment in large-scale, mission-critical environments.

This role encompasses the sustainment of the entire storage environment across two geographically dispersed locations, supporting heterogeneous, multi-vendor high-performance storage platforms, mass storage subsystems, and fiber channel interconnection fabrics.