Senior Staff Hardware Architect for AI Rack Systems

QUALCOMM, Inc.

California

On-site

USD 170,000 - 255,000

Full time

13 days ago

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Job summary

Qualcomm Technologies, Inc. is seeking an experienced hardware engineer to design and validate rack-level AI inference solutions for advanced data centers.

You will lead schematics, PCB layouts, and integration of PCIe cards, servers, and networking switches, collaborating with cross-functional teams across mechanical, thermal, SI, regulatory, and manufacturing domains. You will work with ODMs/JDM partners, contribute to SOWs, and travel to development sites to ensure robust hardware

Qualifications

  • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field plus 6+ years hardware experience.
  • Preferred: Master's degree or PhD in related field with 5+ or 4+ years respectively.
  • Experience with PCIe, backplane, high-speed interfaces and EMI/thermal considerations.
  • Experience with regulatory testing and vendor collaboration.

Responsibilities

  • Lead schematics design, PCB layouts, design reviews, component selections, mechanical and thermal designs, and develop test plans.
  • Co-develop functional specifications for systems, cards, sub-systems, and rack-level architectures.
  • Collaborate with ODMs to develop and support customer-specific hardware and system requirements.
  • Coordinate across multiple development sites and travel to customer sites as needed.

Skills

Rack-level integration
PCB design
Schematic capture
Thermal management
Power delivery
Signal integrity

Education

Master's or PhD in EE/related
Bachelor's + 6+ years hardware exp

Tools

Cadence Allegro
Mentor Expedition
SPICE simulations
JTAG debugging

Job description

Qualcomm Technologies, Inc. is seeking an experienced hardware engineer to design and validate rack-level AI inference solutions for advanced data centers.

You will lead schematics, PCB layouts, and integration of PCIe cards, servers, and networking switches, collaborating with cross-functional teams across mechanical, thermal, SI, regulatory, and manufacturing domains. You will work with ODMs/JDM partners, contribute to SOWs, and travel to development sites to ensure robust hardware

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