Senior Hardware Design Engineer, AI Rack Systems

QUALCOMM, Inc.; Austin (TX); On-site; USD 170,000 - 255,000; Full time

Job summary

Qualcomm Technologies, Inc. in Austin is seeking an experienced hardware engineer to design and develop motherboard and rack-level hardware for AI data-center systems.

You will work with mechanical, thermal, SI, PTE, regulatory, and manufacturing teams to drive concept-to-production development and support integration with ODMs. The role requires hands-on PCB design, high-speed interface expertise, and strong collaboration across global teams.

Qualifications

• Experience with system/card/rack-level hardware development from concept to deployment.
• Rack-level integration including chassis, backplane, airflow, and thermal management experience.
• Strong knowledge of high-speed interfaces and PCIe Gen5/6.

Responsibilities

• Lead schematics design, PCB layouts, design reviews, component selections, mechanical and thermal designs, and develop test plans.
• Co-develop functional specifications for systems, cards, sub-systems, and rack-level architectures.
• Collaborate with internal teams and ODMs to develop and support customer-specific hardware and system requirements.
• Facilitate consensus on technical trade-offs at hardware, software, and chip design levels.
• Support architecture and card designs including accelerator SoCs, memory, I/O, power delivery, electrical/mechanical integration, and PCB definition/design.

Skills

Rack-level design

Schematic design

PCB layout

JTAG debugging

Cross-functional collaboration

Education

Bachelor's degree in Electrical Engineering

Bachelor's degree in Computer Science

Tools

Cadence Allegro

Mentor Expedition

Job description

Qualcomm Technologies, Inc. in Austin is seeking an experienced hardware engineer to design and develop motherboard and rack-level hardware for AI data-center systems.

You will work with mechanical, thermal, SI, PTE, regulatory, and manufacturing teams to drive concept-to-production development and support integration with ODMs. The role requires hands-on PCB design, high-speed interface expertise, and strong collaboration across global teams.