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TYLsemi is seeking a Senior Staff Physical Design Engineer to lead end-to-end physical implementation for cutting-edge semiconductor designs. You will drive floorplanning, power planning, placement, CTS, routing, and verification, collaborating with RTL, DFT, STA, package, and CAD teams to meet tape-out deadlines.
You will mentor junior engineers, refine flows, and contribute to methodology improvements, ensuring robust PPA across 7nm/5nm/3nm nodes.
We are looking for a highly skilled Senior Staff Physical Design Engineer to drive end-to-end physical implementation for advanced semiconductor designs acrosscutting-edgetechnology nodes. The ideal candidate will lead block/subsystem-level implementation activities, collaborate cross-functionally with RTL, STA, DFT, and CAD teams, and ensure high-quality tape-outs withstrongfocus on power, performance, and area (PPA). This role requires deepexpertisein physical design methodologies, debugging complex issues, and mentoring junior engineers.
Lead full-chip or block-level physical design implementation fromfloorplanningto GDS signoff.
Drivefloorplanning, power planning, placement, CTS, routing, optimization, and physical verification closure.
Analyze andoptimizetiming, congestion, IR drop, EM, and power for advanced technology nodes.
Collaborate with RTL, DFT, STA, package, and CAD teams to resolve implementation and signoff challenges.
Develop and improve physical design flows, automation scripts, andmethodologyenhancements.
Support tape-out activities and ensure design signoff quality across all implementation stages.
Mentor junior engineers and contribute to technical reviews and best practices.
12+ years of hands-on experience in ASIC/SOC physical design implementation.
Bachelor’s orMaster’sdegree in Electronics, Electrical Engineering, VLSI, or related field.
Strongexpertisein industry-standard EDA tools such as CadenceInnovus, Synopsys ICC2,PrimeTime, andStarRC.
Solid understanding of timing closure, low-power design techniques, signal integrity, IR/EM analysis, and physical verification.
Experience working on advanced technology nodes (7nm/5nm/3nm preferred).
Strong scripting skills inTcl, Perl, or Python for automation and flow enhancement.
Excellent debugging, problem-solving, communication, and stakeholder collaboration skills.
Experience withhierarchical and top-level SOC integration.
Exposure to ML/AI-based design optimization methodologies.
Knowledge of package-aware implementation and multi-die/chiplet architectures.
Consistent delivery of high-quality physical design milestones with minimal schedule impact.
Successful closure of timing, power, area, and reliability metrics for complex SOC designs.
Proactive identification and resolution of implementation bottlenecks and signoff risks.
Positive contribution to team productivity,methodologyimprovements, and mentoring initiatives.