Senior / Staff Dry Etch Process Development Engineer

Intel Corporation; Albuquerque (NM); On-site; USD 156,000 - 255,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Job summary

Intel Corporation seeks a Module Development Engineer to lead the design, development, and optimization of cutting-edge manufacturing processes and equipment. You will drive DOE/SPC-based improvements, guide cross-functional teams, and ensure readiness for high-volume production in a fast-paced semiconductor environment.

The role emphasizes technology roadmaps, process efficiency, and collaboration with suppliers and internal teams to advance Intel’s device architectures.

Qualifications

• Design of Experiments (DOE) and Statistical Process Control (SPC) methodologies in semiconductor process development and optimization.
• Leadership of cross-functional semiconductor process development projects across engineering disciplines.
• Experience with advanced Dry Etch/Plasma Etch technologies and MBPS (model-based problem solving).

Responsibilities

• Lead the development and implementation of sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
• Perform process integration to meet device specs for high-volume manufacturing and future tech.
• Conduct feasibility studies and drive roadmaps for technology processes aligned with Intel’s goals.

Skills

DOE

SPC

Cross-functional leadership

MBPS

Education

PhD in STEM with 5+ years Dry Etch/Plasma Etch

MS in STEM with 7+ years Dry Etch/Plasma Etch

BS in STEM with 10+ years Dry Etch/Plasma Etch

Job description

Job Details:

Job Description:

The Role and Impact As a Module Development Engineer, you will lead the design, development, and optimization of cutting-edge manufacturing processes and equipment solutions that enable Intel’s innovative device architectures. Your day-to-day responsibilities will include conducting feasibility studies, driving process integration, and collaborating with cross-functional teams to ensure process readiness and scalability for high-volume manufacturing. Your contributions will play a pivotal role in advancing Intel’s technology roadmap while optimizing production efficiency and achieving superior product performance and quality. Business group Intel Corporation’s Manufacturing and Operations organization is dedicated to delivering world-class manufacturing processes that support Intel’s leadership in semiconductor innovation. The team focuses on developing advanced technologies and manufacturing solutions to meet evolving industry demands. Through collaboration across global teams, this group drives Intel’s mission to create transformative technology that powers the future.

Key Responsibilities

• Lead the development and implementation of technically sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
• Perform process integration and provide solutions to meet desired device specifications for high-volume manufacturing and future technologies.
• Conduct research and pathfinding activities to enable the manufacture of innovative device architectures and ensure scalability for high-volume production.
• Develop roadmaps and strategies for technology processes that align with Intel’s future goals while maintaining cost sensitivity.
• Collaborate with equipment and materials suppliers to enable process advancements and enhance production outputs.
• Perform feasibility studies using theoretical simulations and practical engineering methods to evaluate process technology capabilities.
• Recommend and implement modifications to manufacturing processes and equipment to optimize efficiency, reliability, and yield.
• Stay updated on industry trends and technical advancements to drive innovation and maintain Intel’s competitive edge.

Qualifications:

• PhD in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or a related STEM field, with at least 5 years of semiconductor Dry Etch/Plasma Etch process development experience; OR
• Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with at least 7 years of semiconductor Dry Etch/Plasma Etch process development experience; OR
• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with at least 10 years of semiconductor Dry Etch/Plasma Etch process development experience.
• 2 years of experience applying Design of Experiments (DOE) and Statistical Process Control (SPC) methodologies in semiconductor process development and optimization.
• 2+ years of experience leading cross-functional semiconductor process development projects, collaborating across multiple engineering disciplines (e.g., process engineering, integration, yield, and equipment engineering) and driving technical solutions to achieve project and manufacturing objectives.

Preferred Qualifications

• Experience with advanced Dry Etch/Plasma Etch technologies, including Through-Silicon Via (TSV) processes.
• Experience working in semiconductor foundry or advanced technology development environments.
• Experience with process automation systems and advanced process control methodologies.
• Experience collaborating with semiconductor equipment suppliers on process optimization, development, and implementation.
• Experience driving process improvements related to yield, defect reduction, process stability, and manufacturing performance.
• Experience in driving technical work groups solving complex dry etch related problem applying MBPS (model-based problem solving)
• Demonstrated technical leadership in complex semiconductor process development initiatives involving multiple engineering teams.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, New Mexico, Albuquerque

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $155,520.00-255,200.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.