Intel Foundry Module Development Engineer (Ph.D.)

Intel Corporation; Hillsboro (OR); On-site; USD 134,000 - 189,000; Full time

Benefits offered by this job

Health benefits

Stock bonuses

Retirement plan

Vacation

Job summary

Intel Corporation in Hillsboro, Oregon, seeks a Module Development Engineer to drive development, optimization, and HVM transfer of advanced semiconductor processes. You will work on lithography, epitaxy, thin films, metrology, and process integration, collaborating with suppliers and internal teams.

You will apply DOE and SPC methodologies, perform data-driven analyses, and document findings to support robust technology transfer and yield enhancement.

Qualifications

• Ph.D. in a STEM field (expected completion before start date).
• 6+ months of semiconductor fabrication/process development experience.
• Experience with cleanroom environments or semiconductor lab work.
• Experience with data analysis/statistics and engineering software.

Responsibilities

• Design, execute, and optimize experimental runs to advance semiconductor processes, equipment hardware, and new material capabilities.
• Apply statistical modeling, DOE, and control systems to reduce variability and drive yield improvement.
• Collaborate with external tool/material suppliers and internal teams to co-develop equipment and process methods.
• Support technology transfer from development to high-volume manufacturing, resolving root causes of excursions.
• Document findings and recommendations in engineering reports and presentations.

Skills

Data analysis

Python

MATLAB

Statistics

DOE

Education

Ph.D. in STEM

Tools

ALD

CVD

PVD

CD-SEM

TEM

AFM

Ellipsometry

Job description

Job Details: Job Description: About the Role Intel Logic Technology Development (LTD) designs and scales the advanced semiconductor process technologies that power future generations of Intel architecture. As a Module Development Engineer, you will drive the development, optimization, characterization, and high-volume manufacturing (HVM) transfer of leading-edge semiconductor processes.

Patterning & Removal: Lithography, Overlay, Wet Etch, Dry/Plasma Etch, Chemical Mechanical Planarization (CMP). Thin Films & Doping: Epitaxy (EPI), Thin-Film Deposition (ALD/CVD/PVD), Diffusion, Ion Implantation, Metals/Metallization, Dielectrics. Metrology, Yield & Integration: In-line Metrology, FEOL/BEOL Process Integration, Defect Reduction, Yield Analysis, Electrical Characterization.

Key Responsibilities ("What You Will Do")

• Process & Hardware Engineering: Design, execute, and optimize experimental runs to advance semiconductor processes, equipment hardware, and new material capabilities.
• Process Control & Data Analytics: Apply statistical modeling, Design of Experiments (DOE), and control systems (SPC, APC, Run-to-Run) to reduce variability, mitigate defects, and drive yield enhancement.
• Cross-Functional & Vendor Collaboration: Partner with external tool/material suppliers and internal integration teams to co-develop cutting-edge equipment and process methodologies.
• HVM Technology Transfer: Resolve equipment, process, and yield excursion root causes to ensure smooth, robust technology transfer from development into high-volume manufacturing.
• Documentation & Technical Reporting: Document experimental findings, operating procedures, and technical recommendations through engineering reports and presentations.

Qualifications:

• Minimum Qualifications Education: Ph.D. in Electrical Engineering, Chemical Engineering, Materials Science & Engineering, Physics, Mechanical, Chemistry, or a related STEM field (expected completion prior to start date).
• Hands-on Experience: 6+ months of experience with semiconductor fabrication, process development, device research, materials research, or related semiconductor technology, including one or more of the following: lithography (Litho)/overlay, epitaxy (EPI), wet etch, dry etch, thin-film deposition, diffusion, ion implantation, CMP/planarization, metals/metallization, dielectrics, metrology, process integration, yield, or electrical characterization.
• Preferred Qualifications Environment & Tooling: 6+ months in a cleanroom or semiconductor research lab working directly with fabrication or analytical instrumentation (e.g., ALD, CVD, PVD, plasma etch, CD-SEM, TEM, AFM, spectroscopic ellipsometry).
• Data Science & Automation: 6+ months utilizing statistical methodologies (DOE, SPC) and engineering software/scripting languages (Python, MATLAB, JMP, C#, or equivalents) for data analysis and automation.
• Device Physics & Integration: Academic or research specialization in transistor architecture, advanced semiconductor materials, or FEOL/BEOL process integration.
• Technical Dissemination: Proven track record of presenting technical findings through dissertations, peer-reviewed publications, conference proceedings, patents, or white papers.

Job Type: Shift: Shift 1 (United States of America)

Primary Location: US, Oregon, Hillsboro Additional Locations:

Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry.

It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Job posting details (such as work model, location or time type) are subject to change. ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. Intel’s official careers website.

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