Senior Silicon PIC Design Engineer

TorchLink; Cupertino (CA); On-site; USD 120,000 - 180,000; Full time

Job summary

TorchLink in Cupertino, CA, develops integrated photonic devices for high-speed optical interconnects. The role covers passive and active device design, plus establishing measurement plans to characterize fabricated devices.

Ideal candidates hold a Ph.D. in EE/optics or related fields with 3+ years of experience and strong RF and photonics tool proficiency. Collaboration across wafer processing, packaging/testing, and reliability teams is essential.

Qualifications

• Ph.D. in EE, materials, optics or physics related to semiconductor lasers required.
• 3+ years of experience preferred.
• Experience with RF design, simulation and optical/electrical modeling tools (HFSS, ADS).
• Experience with photonics design tools (Ansys/Lumerical, RSoft, Photon Design, Tidy3D).
• Scripting GDS layout of photonics components and chips (GDSfactory, Luceda IPKISS).
• Experience in wafer processing, packaging/testing, reliability and failure analysis preferred.

Responsibilities

• Develop integrated photonic devices for high-speed optical interconnects.
• Design passive devices (couplers, splitters, PSR, WDM).
• Design active devices (MZM and MRM).
• Develop measurement methodologies to test fabricated devices.

Skills

RF design

Optical modeling

Electro‑optical design

Photonics design

Education

Ph.D in EE/Optics/Materials

Tools

HFSS

ADS

Ansys/Lumerical

RSoft

Photon Design

Tidy3D

GDSfactory

Luceda IPKISS

Job description

• Work on the development of integrated photonic devices for high-speed optical interconnect applications.
• Conduct passive device design, including couplers, splitters, PSR and WDM components
• Conduct active optical device design, including MZM and MRM.
• Develop measurement methodology and plan to test and characterize the fabricated devices.

Qualifications

• Ph.D degree in EE, materials, optics, physics related to semiconductor lasers industry experience required.
• 3+ years of experience is preferred.
• Experience with RF design, simulation, and use of optical and electrical modeling tools such as HFSS, ADS to design electro-optical devices.
• Experience with photonics design and simulations tools such as Ansys/Lumerical, RSoft, Photon Design, Tidy3D.
• Experience with script based GDS layout of photonics components, circuits and full product chips, utilizing tools such as GDSfactory, Luceda IPKISS.
• Experience in wafer processing, packaging/testing, reliability and failure analysis is preferred.