Senior Silicon Photonics Design & Packaging Lead

TSMC - Taiwan Semiconductor Manufacturing Company Limited; California; Hybride; USD 149 000 - 263 000; Plein temps

Résumé du poste

TSMC - Taiwan Semiconductor Manufacturing Company Limited in San Jose, CA seeks a Technical Lead/Manager for Silicon Photonics to define and implement custom design solutions in collaboration with ecosystem partners.

Reporting to the Senior Director, Design and Technology Platform, this role combines hands-on circuit design, verification, packaging, and cross-functional leadership in a hybrid work environment.

Qualifications

• Masters or PhD in electrical engineering, opto-electronics, physics or related field.
• Minimum 10 years of relevant industry experience in silicon photonics design and characterization.
• Experience with Ansys/Lumerical simulation tools.
• Experience with optical packaging including fiber and coupling techniques.
• Hands-on experience with electrical and optical process test structures and automated characterization for optical PDK validation.
• Ability to work on multiple projects in a fast-paced environment.

Responsabilités

• Drive the definition, design, simulation, layout and tape-out, test and validation, data analysis and performance debug of complex silicon photonics circuits using optical PDK components.
• Work with customers on silicon photonics product definition, design, integration, testing and qualification.
• Define and drive the implementation of multi-die silicon photonics packaging solutions with 3D integration.

Connaissances

Silicon photonics design

Optical packaging

Fiber coupling

Automation/characterization

Project leadership

Formation

Masters or PhD in electrical engineering, opto-electronics, physics or related field

Outils

Ansys

Lumerical

Cadence Virtuoso

Synopsys OptoCompiler

Description du poste

TSMC - Taiwan Semiconductor Manufacturing Company Limited in San Jose, CA seeks a Technical Lead/Manager for Silicon Photonics to define and implement custom design solutions in collaboration with ecosystem partners.

Reporting to the Senior Director, Design and Technology Platform, this role combines hands-on circuit design, verification, packaging, and cross-functional leadership in a hybrid work environment.