Senior RF Power Amp Design Engineer (GaAs/GaN) – Up to $200k

Octagon Group; Chicago (IL); On-site; USD 180,000 - 220,000; Full time

Job summary

Octagon Group in Chicago, IL is seeking an accomplished RF Power Amplifier Design Engineer to own the full lifecycle of high‑power RF amplifier design, GaAs and GaN integration, and thermal management. This on‑site role offers exposure to advanced semiconductor architectures and a competitive compensation package.

In this technical leadership position you will drive simulations, tape-out activities, and cross‑functional collaboration with layout, packaging, and test teams to deliver

Qualifications

• Minimum of 5+ years of RF power amplifier design and active circuit development.
• Expertise in GaAs, GaN, and LDMOS transistor technologies.
• Proficient with RF CAD tools: Keysight ADS, AWR Microwave Office, Ansys HFSS.
• Experience with lab test equipment: VNAs, signal generators, spectrum analyzers, power meters.
• Strong impedance matching, stability analysis, thermal management, and linearization knowledge.
• Mandatory US citizenship or Green Card holder status for Chicago operations.

Responsibilities

• Architect, design, and optimize high-efficiency RF power amplifiers and MMIC circuits.
• Perform simulations: load-pull, S-parameter, harmonic balance; validate with measurements.
• Implement linearization such as DPD and envelope tracking.
• Collaborate with layout, packaging, and test teams during hardware prototyping.
• Ensure compliance with military, aerospace, and telecommunications specs.
• Maintain design documentation and test reports.

Skills

Power amplifier design

GaAs/GaN/LDMOS

RF circuit debugging

Impedance matching

Thermal management

RF test instrumentation

Education

Bachelor/Master/PhD in Electrical Engineering or related

Tools

Keysight ADS

AWR Microwave Office

Ansys HFSS

Job description

Octagon Group in Chicago, IL is seeking an accomplished RF Power Amplifier Design Engineer to own the full lifecycle of high‑power RF amplifier design, GaAs and GaN integration, and thermal management. This on‑site role offers exposure to advanced semiconductor architectures and a competitive compensation package.

In this technical leadership position you will drive simulations, tape-out activities, and cross‑functional collaboration with layout, packaging, and test teams to deliver