Senior Product Development Engineer, DRAM CPI & Packaging

Micron Technology, Inc; Boise (ID); On-site; USD 100,000 - 130,000; Full time

Job summary

Micron Technology, Inc is seeking a Product Development Engineer 4 in Boise, Idaho. You will be responsible for CPI related issues for Micron’s DRAM memory products and establish package program plans for new fab technology.

The ideal candidate has a Master's degree in a relevant field with at least 60 months of experience. You must understand chip-package interaction and have experience in electrical data analysis related to DRAM/NAND devices.

Qualifications

• Master’s degree in Material Science Engineering, Chemical Engineering, or related field.
• 60 months of experience in the job offered or an Engineering-related occupation.
• Understanding of chip-package interaction including assembly process.

Responsibilities

• Responsible for CPI related issues for Micron’s DRAM memory products.
• Establish package program plans for new DRAM fab technology.
• Coordinate end-to-end reviews for DRAM device/package/module.

Skills

Material Science Engineering

Chip-package interaction (CPI)

DRAM/NAND fabrication knowledge

Electrical data analysis

Education

Master’s degree in relevant field

Job description

Micron Technology, Inc is seeking a Product Development Engineer 4 in Boise, Idaho. You will be responsible for CPI related issues for Micron’s DRAM memory products and establish package program plans for new fab technology.

The ideal candidate has a Master's degree in a relevant field with at least 60 months of experience. You must understand chip-package interaction and have experience in electrical data analysis related to DRAM/NAND devices.