Senior Process Engineer - Thin-Film Deposition & Innovation

Lam Research Corporation; City of Albany (NY); Hybrid; USD 120,000 - 150,000; Full time

Benefits offered by this job

On-site Flex

Virtual Flex

Job summary

Lam Research Corporation in the United States is seeking a Process Engineer to push the boundaries of semiconductor deposition and surface engineering. You will develop new process formulations, define equipment requirements, and evaluate test data to drive next‑gen device performance while collaborating across teams and with customers.

Rooted in a strong background in materials science or chemical engineering, you will contribute to sub‑2nm CMOS roadmap initiatives, mentor technicians, and

Qualifications

• Master’s degree in Materials Science, Chemical Engineering, Chemistry or Physics with 6+ years of experience; or a PhD with 3+ years’ experience; or equivalent experience.
• Experience with semiconductor equipment, surface preparation, and analytical techniques.
• Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE).
• Highly proficient in MATLAB, Python, or other similar scientific computing language.
• Working knowledge of statistical analysis and problem‑solving methodologies.

Responsibilities

• Conduct process engineering research, development, and evaluation in support of Lam’s cutting‑edge semiconductor equipment and systems.
• Review and enhance processing techniques and methods applied in the manufacture and fabrication of products.
• Develop and sustain new processes and process improvements to reduce production costs and increase yields.
• Compile and analyze test data to establish next steps in process development and determine appropriate limits and variables for process specifications.
• Collaborate internally to plan, collect data, analyze results, and report on customer demos for existing process applications.
• Partner cross‑functionally and with customers to understand roadmaps, process flow, inflection points, requirements, and business challenges.
• Contribute to next generation product development and release activities supporting the semiconductor roadmap.
• Provide leadership, clear direction, and guidance to process technicians to support execution activities.
• Be responsible for thin film deposition (CVD, ALD, plating) process development projects in support of LAM JDAs with IBM.
• Collaborate with customer process engineers to develop solutions
• Collaborate with customer process and hardware engineers to troubleshoot hardware/process problems/interactions.
• Be flexible to be cross trained into dry etch, wets/clean and process integration.
• Deliver creative solutions in process design and its applications.
• Present results, both internally and externally, to engineers, executives, customers, etc

Skills

Statistical methods (SPC/DOE)

MATLAB

Python

Process optimization

Team collaboration

Education

Master’s degree in Materials Science or Chemical Engineering

PhD (preferred)

Tools

MATLAB

Python

JMP/Minitab

ALD/CVD/PVD knowledge

RIE/PECVD knowledge

Job description

Lam Research Corporation in the United States is seeking a Process Engineer to push the boundaries of semiconductor deposition and surface engineering. You will develop new process formulations, define equipment requirements, and evaluate test data to drive next‑gen device performance while collaborating across teams and with customers.

Rooted in a strong background in materials science or chemical engineering, you will contribute to sub‑2nm CMOS roadmap initiatives, mentor technicians, and