Senior Process Engineer, MEMS for Neural Interfaces

Neara

Addison (TX)

Hybrid

USD 135,000 - 150,000

Full time

14 days+

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Job summary

Precision Neuroscience is seeking an R&D Senior Process Engineer to lead materials and MEMS manufacturing development for neural interface technologies in Addison, TX. The role focuses on thin-film encapsulation and integration with polymer films within our in-house MEMS facility.

The successful candidate will guide the transition from feasibility to scale-up, collaborate with cross-functional teams, and contribute to IP and publications while ensuring compliance with ISO certifications and

Qualifications

PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related field, with a research focus on thin film ceramics or dielectric materials (or MS with equivalent industry experience).
5+ years of hands‑on experience with thin film ceramic deposition techniques (ALD, PECVD, sputtering, e‑beam evaporation).
Experience in thin film characterization methods such as ellipsometry, XRD, SEM/TEM, AFM, profilometry, and electrochemical impedance spectroscopy (EIS).
Strong working knowledge of MEMS microfabrication processes (photolithography, dry/wet etching, metallization, wafer/substrate handling) and cleanroom experience.
Proven ability to design and interpret test studies for evaluating encapsulation or barrier film reliability.
Understanding of failure mechanisms in multilayer thin film stacks, including interfacial adhesion, stress management, and mechanical fatigue under flexing or cyclic loading.
Excellent experimental design (DOE) skills and data analysis capabilities to drive process optimization decisions.
Strong written and verbal communication skills, with experience documenting technical processes and presenting findings to cross‑functional teams.

Responsibilities

Lead the design and development of thin film ceramic encapsulation/insulation layers integrated with polymer films.
Define material selection criteria and deposition strategies (ALD, PECVD, sputtering, e-beam evaporation) based on required film properties: barrier performance, dielectric strength, stress/adhesion behavior, and biocompatibility.
Characterize film properties and analyzing data from techniques such as ellipsometry, XRD, SEM/TEM, profilometry, and electrochemical impedance spectroscopy (EIS).
Collaborate with process engineers to integrate ceramic thin film steps into a MEMS microfabrication flow (e.g., photolithography, etching, metallization).
Develop test structures and DOEs to systematically evaluate ceramic film performance as a function of deposition parameters, thickness, and multilayer stack design.
Author technical reports, process documentation, and IP disclosures; present findings to internal stakeholders and, where appropriate, at scientific conferences or in peer‑reviewed publications.
Stay current with emerging thin film ceramic materials and deposition technologies relevant to implantable bioelectronics, and recommend adoption where beneficial.