Senior Process Engineer: High-Yield Semiconductor Packaging

Future Ventures; Bastrop (TX); On-site; USD 120,000 - 170,000; Full time

Job summary

SpaceX is seeking a Sr. Process Engineer to own day-to-day operation and uptime of packaging and assembly tools on the production floor.

You will design processes from lab to production ramp, monitor critical parameters, and drive rapid root-cause resolution across die attach, bonding, cleaning, and packaging. The role requires 5+ years in semiconductor packaging or related fields, with experience operating high-volume equipment and knowledge of sub-µm die-bonding, wafer prep, and materials used

Qualifications

• BS or MS in an engineering discipline required.
• 5+ years in semiconductor packaging, assembly, process engineering or advanced manufacturing.

Responsibilities

• Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders.
• Design production processes from lab bench through proof of concept and production ramp.
• Monitor and control key process parameters, ensuring repeatability, calibration, and adherence to specs.
• Troubleshoot tool and process issues in real-time to minimize downtime and drive root-cause resolution.
• Collaborate with engineering teams to stabilize and improve process flows for die attach, bonding, cleaning, and packaging.
• Analyze production data and yield trends to identify opportunities for optimization and defect reduction.
• Push process yields above 99.9% and thermal-cycle reliability beyond 1000 cycles.
• Support factory scaling, qualifying new tools and recipes to enhance throughput and yield.

Skills

Semiconductor packaging

Process engineering

Statistics / DOE

Troubleshooting

Education

BS or MS in engineering

Tools

Flip-chip bonding

Wafer processing

Plasma cleaners

Wire bonding

Job description

SpaceX is seeking a Sr. Process Engineer to own day-to-day operation and uptime of packaging and assembly tools on the production floor.

You will design processes from lab to production ramp, monitor critical parameters, and drive rapid root-cause resolution across die attach, bonding, cleaning, and packaging. The role requires 5+ years in semiconductor packaging or related fields, with experience operating high-volume equipment and knowledge of sub-µm die-bonding, wafer prep, and materials used