Senior Principal Packaging Engineer

MACOM; Morgan Hill, Northern (CA, KY); Hybride; USD 161 000 - 228 000; Plein temps

Avantages offerts par ce poste

RSU eligible

Cash bonuses

Résumé du poste

MACOM is seeking a Senior Principal Packaging Engineer to lead advanced semiconductor packaging efforts. The role focuses on defining architectures, materials, and processes for high-volume production across diverse package types including QFP, QFN, BGA, and 2.5D/3D strategies.

Candidates should have 10+ years in packaging, a strong mechanical/ materials background, and experience with Datacon Evo equipment.

Qualifications

• 10+ years of experience in semiconductor packaging development
• Broad working knowledge of IC package families such as QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, SiP/modules

Responsabilités

• Define package architectures, materials, structures, and assembly process flows meeting reliability, performance, manufacturability and cost
• Develop tooling and processes for high-volume production
• Perform verification and qualification of tooling, machines and materials in development projects
• Coordinate with vendors and internal teams to qualify and debug equipment
• Create and review design & equipment process FMEA
• Provide technical manufacturing support and root-cause analysis
• Contribute to risk assessments and project reviews for executive reporting

Connaissances

Package development

Semiconductor packaging

IC package families

Advanced packaging

Formation

Bachelor's degree in Mechanical Engineering

Outils

Datacon Evo

Description du poste

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure! **Senior Principal Packaging Engineer****Responsibilities:**• Develop FCMCM package - Define package architectures, materials, structures, and assembly process flows that meet product requirements for reliability, performance, manufacturability, and cost• Participate in technology development projects which may include: defining the specifications, guidelines and developing assembly processes with process recipe development, equipment upgrade and material selection• Anticipate and propose solution to mitigate potential issues and limitation of process/material/equipment throughout the development stages.• Perform continuous improvement activities of existing assembly processes, equipment and materials for quality improvement and cost saving• Design new customized tooling to adopt off the shelf equipment for our high-volume production.• Perform verification and qualification activities for new tooling, machine and materials in development projects• Work directly with equipment vendors, subcontractors and internal team to qualify, bring up and debug equipment.• Creation, regular review and updating of design & equipment process FMEA• Technical support on Manufacturing with troubleshooting and providing technical solution• Conduct risk assessments and mitigation as well as project reviews and report the results to the executive level on a regular basis• Coordinate and support initial mechanical reliability test with failure analysis for root cause finding**Requirements:**• B.S. or higher in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, or related field.• 10+ years of experience in semiconductor packaging development, package technology, assembly process development, package design, product/package engineering, or related fields.• Broad working knowledge of IC package families such as QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, SiP/modules, and power packages.• Knowledge on die attach equipment of Datacon Evo is preferred.• Deep expertise in one or more advanced packaging areas such as fan-out packaging, panel-level packaging, 2.5D/3D integration, heterogeneous integration, embedded die/passives, SiP/modules, high-density substrates/RDL, hybrid bonding, or high power packaging is preferred.• Ability to communicate technical tradeoffs, risks, recommendations, and project status clearly to both technical and management audiences.• Experience in materials characterization and analysis, DOE, reliability standards, and FA technique is preferred**EEO:**MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.**Reasonable Accommodation:**MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process, please call [phone] or email HR\\[e-mail]. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.**ITAR**Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.**RSU Eligible**This position is eligible to receive restricted stock unit (RSU) awards and cash bonuses, solely at MACOM’s discretion, subject to individual and company performance.**Salary Range**The Salary Range for this position is $161,000 – $228,000. Actual salary offered to candidate will depend on several factors, including but not limited to, work location, relevant candidates’ experience, education, and specific knowledge, skills, and abilities.