Senior Principal Electrical Engineer

Coherent Corp.; Saxonburg (PA); On-site; USD 120,000 - 200,000; Full time

Job summary

Coherent Corp. seeks an experienced hardware architect to lead RF/microwave and high-speed mixed-signal design for next-generation optical transceivers and production test hardware.

You will define schematics, PCBAs, and instrumentation for 100G+/200G/400G interconnects, while optimizing SI/PI, EMI/EMC, grounding, and thermal performance. Collaboration with cross-functional teams is essential to deliver complete solutions.

Responsibilities

• Lead RF/microwave and high-speed mixed-signal hardware architecture for optical transceivers and test platforms.
• Design high-speed schematics and PCBAs for 100G+, 200G, and 400G interconnects.
• Own board-level tradeoffs for SI/PI, EMI/EMC, grounding, thermal, manufacturability, and cost.
• Architect instrumentation for validation, calibration, automation, and manufacturing test.
• Select and qualify RF/microwave, analog, precision measurement, and power components.
• Define PCB stackups, materials, impedance targets, via structures, and fabrication rules.
• Collaborate with SI/PI, packaging, optics, firmware, software, mechanical, reliability, and operations teams.
• Lead schematic capture, layout strategy, verification, bring-up, debug, and production release.
• Define digital control interfaces and hardware/firmware interaction.

Job description

Job Description

• Lead complete RF/microwave and high-speed mixed-signal hardware architecture for next-generation optical transceivers, evaluation boards, reference platforms, and production test hardware.
• Design high-speed schematics and PCBAs for 100G/lane, 200G/lane, 400G/lane and beyond interconnects, supporting 800G, 1.6T, 3.2T and future architectures where applicable.
• Own board-level tradeoffs for signal integrity, power integrity, EMI/EMC, grounding, return path control, isolation, thermal performance, manufacturability, serviceability, cost, reliability, and schedule.
• Architect and design high-performance instrumentation used for validation, characterization, calibration, automation, manufacturing test, and sustaining support of fiber optic transceiver modules.
• Select and qualify high-speed, RF, microwave, analog, precision measurement, clocking, DSP, control, sensing, connector, cable, interconnect, and power components.
• Define PCB stackups, materials, copper weights, dielectric selection, via structures, backdrill strategy, impedance targets, loss budgets, fabrication rules, assembly constraints, and acceptance criteria.
• Partner with SI/PI, packaging, optics, firmware, software, mechanical, thermal, reliability, manufacturing, supply chain, and operations teams to deliver complete product and test solutions.
• Lead schematic capture, layout strategy, layout review, RF structure review, BOM review, DFM/DFT review, design verification, bring-up, debug, characterization, and production release.
• Define digital control interfaces and hardware/firmware interaction