Director of Hardware Engineering

DAS Technology Group; Costa Mesa (CA); On-site; USD 180,000 - 260,000; Full time

Job summary

DAS Technology Group in Costa Mesa, CA, seeks a Senior Manager/Director of Hardware Engineering to lead the hardware organization responsible for high-speed board-level hardware, reference designs, and production readiness.

You will build and mentor a multi-disciplinary team focused on high-speed PCB design, SI/PI, system bring-up, and validation, collaborating with IC design, validation, product marketing, and customers to ensure on-time delivery.

Qualifications

• 12+ years in hardware engineering across high-speed digital, mixed-signal, or analog systems.
• 3+ years in a management role leading cross-functional teams.
• Proven track record delivering hardware from concept to volume production in data center, networking, optical modules, or similar.

Responsibilities

• Define and execute the hardware roadmap aligned with data center and connectivity markets.
• Lead design and development of complex interconnect solutions and reference designs.
• Oversee high-speed PCB architecture, schematic capture, layout, SI/PI analysis, and DFM.
• Drive rigorous board-level verification, bring-up, and characterization with lab equipment.
• Build and mentor a multi-disciplinary hardware/SI/PI/systems team.
• Collaborate with IC design, validation, product marketing, and customers for seamless integration.

Skills

High-speed PCB design

Signal integrity

Power integrity

SerDes interfaces

Cross-functional leadership

Vendor management

Communication

Education

Electrical/Computer Engineering degree

Tools

PADS/xDxDesigner

Allegro

HyperLynx

SIwave

HFSS

Keysight ADS

Job description

Senior Manager/Director, Hardware Engineering

• The Sr. Manager/Director of Hardware Engineering leads the hardware engineering organization within the business unit. This role is responsible for the architecture, design, development, validation, and production readiness of high-speed board-level hardware, reference designs, evaluation and validation platforms, and interconnect solutions that enable our analog ICs devices.
• The ideal candidate builds and leads a multi-disciplinary team focused on high-speed PCB design, signal integrity (SI), power integrity (PI), system bring-up, and characterization while driving close collaboration with IC design, validation, applications, product marketing, and customers.

Key Responsibilities:

• Define and execute the hardware engineering roadmap aligned with our product strategy for data center and optical/copper connectivity markets.
• Lead the design and development of complex interconnect solutions for internal hardware needs as well as for customer hardware reference designs.
• Oversee high-speed PCB architecture, schematic capture, layout, SI/PI analysis, and design for manufacturing (DFM).
• Drive rigorous board-level verification, bring-up, debug, and characterization using advanced lab equipment (VNA, TDR, high-speed oscilloscopes, BERTs, etc.).
• Establish and continuously improve design methodologies, simulation tool flows (HyperLynx, SIwave, HFSS, ADS, etc.), and measurement best practices.
• Build, mentor, and scale a high-performing team of hardware, SI/PI, and systems engineers; manage performance, career development, and technical excellence.
• Partner closely with IC design, packaging, applications engineering, validation engineering, test engineering, signal integrity engineering, product marketing, and operations to ensure seamless product integration and time-to-market.
• Engage directly with key customers and ecosystem partners on reference designs, technical requirements, and solution enablement.
• Manage project schedules, resources, budgets, and risk for multiple concurrent hardware programs from concept through production release.
• Champion design quality, reliability, EMI/EMC compliance, cost optimization and on time delivery
• Oversee interactions with external vendors and plan for fabrication and assembly of boards to meet demands.

Job requirements (Minimum qualifications and Previous Relevant Work Experience, Key competencies required):

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field (PhD a plus).
• 12+ years of progressive hardware engineering experience in high-speed digital, mixed-signal, or analog systems, with at least 3+ years in a management role.
• Deep expertise in high-speed PCB design, multi-layer stack-ups, differential signaling, SerDes interfaces (PCIe, Ethernet, PAM-4, etc.), signal integrity, and power integrity.
• Proven track record delivering complex hardware platforms from concept through volume production in data center, networking, optical modules, or similar environments.
• Hands‑on experience with industry‑standard EDA and SI tools (e.g., PADS/xDxDesigner, Allegro, HyperLynx, SIwave, HFSS, Keysight ADS) and high‑speed lab instrumentation.
• Strong understanding of transmission line theory, impedance control, crosstalk, jitter, and high‑speed link analysis.
• Demonstrated ability to lead cross‑functional teams and influence technical direction in a fast‑paced semiconductor environment.
• Excellent communication, collaboration, and stakeholder management skills.
• Familiarity with advanced packaging, thermal management, and high-density connector systems.
• Familiarity with lab equipment (multimeter, oscilloscopes, VNAs)