Senior Power Integrity Engineer - LPU Packaging

NVIDIA

Santa Clara (CA)

On-site

USD 196,000 - 310,500

Full time

14 days+

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Job summary

NVIDIA is seeking a Senior Power Integrity Engineer for their LPU Packaging team in Santa Clara, CA. This role involves defining power delivery design practices and owning the PI specification for assigned products.

The ideal candidate will have 12+ years of experience in Power Integrity, specialized knowledge in high-current rails, and proficiency with industry-standard tools like PowerSI and Sigrity. The position offers a competitive salary and benefits.

Qualifications

  • 12+ years of relevant work experience in Power Integrity.
  • Proven ownership of chip-package-board PDN design.
  • Hands-on experience with high-current, low-voltage rails.

Responsibilities

  • Define best‑in‑class power delivery design for product development.
  • Drive system‑level PI design and decap placement.
  • Generate and deploy reusable PI models for internal use.

Skills

Power integrity
Electrical Engineering
Experimental analysis
High-speed interfaces
Communication skills

Education

MS or PhD in Electrical Engineering or related field

Tools

PowerSI
Sigrity
ADS
SPICE

Job description

NVIDIA is now looking for a Senior Power Integrity Engineer to join our LPU Packaging team!

Responsibilities
  • Define best‑in‑class power delivery design and optimization practices from die/package through board, tray, and rack levels for the full product development cycle
  • Own the PI specification and methodology for assigned products, defining PDN targets including impedance, droop, noise, and transient response for GPU, HBM, and high‑speed SerDes
  • Architect package‑level PDNs by collaborating with design teams on bump/ball maps, via structures, and decoupling strategies for FCBGA and 25D/3D integrations
  • Drive system‑level PI design, including board‑level PDN planning, decap placement, and VRM interfaces while co‑optimizing with SI, thermal, and mechanical teams
  • Perform PI extraction and simulation for advanced packages and develop integrated chip–package–board co‑simulation flows using industry‑standard tools
  • Generate and deploy reusable PI models, such as SPICE, S‑parameter, and IBIS‑AMI, for use by internal and external partners
  • Define and execute comprehensive lab validation plans to correlate measured impedance, noise, and droop against simulation data and specifications
  • Debug complex system‑level issues including rail noise, jitter‑induced errors, resets, and margin loss during hardware testing and validation
Requirements
  • MS or PhD in Electrical Engineering or a related field, or equivalent experience
  • 12+ years of relevant work experience in Power Integrity
  • A strong background in power integrity for high-current, low-voltage rails within large GPUs, ASICs, or CPUs
  • Proven ownership of the chip‑package‑board PDN design and sign‑off process
  • Hands‑on experience with FCBGA, 25D/3D integration, HBM, or similar high‑power, high‑pin‑count packages
  • Direct experience in the co‑design of bump/ball maps, power/ground planes, and decoupling capacitor networks
  • Proficiency with frequency‑domain PDN impedance analysis and time‑domain transient/droop simulation tools (eg, PowerSI, PowerDC, Sigrity, RedHawk, Totem, HFSS, SIwave, ADS, or SPICE)
  • A deep understanding of board‑level PDN design, including stack‑up definition, plane partitioning, and VRM placement on high‑layer‑count accelerator boards
  • Experience in executing lab measurements using VNAs, oscilloscopes, and PDN analyzers to correlate measured noise and droop to original specifications
Ways to Stand Out
  • Demonstrated leadership of end‑to‑end PI for a major GPU, CPU, or ASIC program from initial concept through mass production
  • Experience with data center or cloud hardware, specifically regarding rack‑level power distribution and how PI choices impact performance headroom
  • Background in co‑designing SI and PI for high‑speed interfaces like PCIe, NVLink, CXL, or Ethernet SerDes to mitigate jitter and noise coupling
  • Strong communication skills with the ability to clearly explain complex PDN trade‑offs and risks to both technical teams and program stakeholders

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 196,000 USD - 310,500 USD for Level 5, and 232,000 USD - 368,000 USD for Level 6.

You will also be eligible for equity and benefits.

NVIDIA is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

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