Senior NPI Packaging Engineer - Lead High-Volume Packaging

Murata Manufacturing Co., Ltd.; San Diego (CA); On-site; USD 122,000 - 159,000; Full time

Job summary

pSemi Corporation, a Murata company, seeks a senior packaging engineer to lead design and development of bump, package, and assembly processes for high-volume, high-reliability applications across industrial, commercial, and automotive segments.

You will collaborate with cross-functional teams on feasibility studies, DoE experiments, and manufacturing capabilities, deliver robust design rules, and mentor junior engineers while driving cost and schedule adherence in a fast-paced environment.

Qualifications

• Bachelor of Engineering in Packaging, Electrical, Mechanical, Materials or Chemical, Physics or Chemistry; MS preferred.
• 5 years of electronics packaging experience; 3 years with master's (or PhD)
• Hands-on experience with package assembly process development.
• Understanding of material properties and interactions with manufacturing processes.
• Experience with design tools such as AutoCAD and Cadence Allegro (or equivalent).
• Experience driving packaging technology developments and working with 3rd party suppliers.
• Familiarity with DOE methodology.

Responsibilities

• Designs bump, package, and assembly processes for high-volume, high-reliability applications and uses data analysis to drive decisions.
• Contributes to packaging roadmap aligned with product lines and technology roadmaps.
• Researches packaging technologies and suppliers to support roadmaps.
• Develops manufacturing processes and documents design rules for product development teams.
• Creates early concept sketches and collects cost estimates for opportunities.
• Assists cross-functional teams in packaging decisions for prototypes and high-volume manufacturing.
• Performs cost and risk assessments for new designs against design rules.
• Performs detailed package design including tolerance analysis and simulations for reliability and producibility.
• Prepares design docs and BOMs for chip fabrication, backend wafer processes, and assembly.
• Executes DoE experiments and captures data to substantiate decisions.

Skills

5 years packaging experience

Hands-on manufacturing equipment

DOE methodology

Presenting technical information

Cross-functional collaboration

Education

Bachelor's degree in Packaging / Electrical / Mechanical / Materials / Chemical or Physics or Chemistry

MS preferred

Tools

AutoCAD

Cadence Allegro

Job description

pSemi Corporation, a Murata company, seeks a senior packaging engineer to lead design and development of bump, package, and assembly processes for high-volume, high-reliability applications across industrial, commercial, and automotive segments.

You will collaborate with cross-functional teams on feasibility studies, DoE experiments, and manufacturing capabilities, deliver robust design rules, and mentor junior engineers while driving cost and schedule adherence in a fast-paced environment.