Senior Packaging Engineer

Mini-Circuits; Carlsbad (CA); On-site; USD 130,000 - 165,000; Full time

Job summary

Mini-Circuits in Carlsbad, CA is seeking a Sr. Packaging Engineer to lead MMIC packaging development from concept to market. You will work with Quality, CAD and external assembly houses to drive innovation and ensure reliable performance.

The role requires 7+ years in engineering, a BS in engineering, and strong knowledge of microwave packaging and chip-and-wire methods. You will design manufacturable package drawings, qualify new vendors, and improve process yields.

Qualifications

• BSME degree with 7+ years engineering experience, including 3+ years in semiconductor packaging.
• MSME or equivalent is preferred.
• Experience with microwave packaging and chip-and-wire manufacturing methods.

Responsibilities

• Lead design and development of manufacturable package drawings with MMIC engineers to meet manufacturing and product goals.
• Lead MMIC assembly discussions with packaging houses (internal and external).
• Maintain and develop package designs including laminate, leadframe, overmold and air cavity construction.
• Collaborate with factories to develop new materials systems and packaging platforms.
• Design tooling and fixturing to facilitate assembly and manufacturing.
• Improve existing manufacturing techniques by researching epoxies and interconnect methods.
• Perform design reviews to optimize performance, quality, and yields.
• Archive design files and ensure documentation control.
• Assist in qualification of new contract manufacturers and improve assembly yields.
• Resolve operational and material issues and support RMAs.
• Comply with procedures and suggest improvements.

Skills

Microwave packaging

Chip-and-wire methods

2D/3D CAD

Microsoft Office

Project management

Communication skills

Education

BSME

MSME or equivalent preferred

Tools

AutoCAD

DraftSight

Inventor

SolidWorks

Job description

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high-performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Circuits’ products are used in a range of wired and wireless communications applications. Our products are also used in detection, measurement and imaging applications, including military communication, guidance and electronic countermeasure systems, commercial, scientific, military land, sea and aircraft; automotive systems, medical systems, and industrial test equipment.

Mini-Circuits’ sells its products to over 20,000 customers globally through our direct sales force, applications engineering staff, sales representatives, as well as through our extensive

Position Summary

The Sr. Packaging Engineer is responsible for leading the development and execution of all packaging processes supporting MMIC. This role owns MMIC packaging and process development to drive innovation and ensure optimal performance. Working closely with Quality & Reliability, CAD and other Engineering teams, as well as internal and external package assembly houses, this position guides projects from design conception through release-to market ensuring alignment with long-term goals.

Salary Range

Salary Range - $130,000 - $165,000

Job Function

• Lead the design and development of manufacturable package assembly drawings in consultation with the MMIC and design engineers to ensure manufacturing and product goals.
• Lead MMIC assembly discussions with internal and external packaging houses.
• Maintain existing package designs and create new package designs including but not limited to laminate, leadframe, overmold and air cavity construction.
• Work with factories to develop new materials systems and packaging platforms.
• Design and optimize tooling and fixturing to facilitate assembly and manufacturing.
• Continuously improve existing manufacturing techniques by researching new epoxies, attachment methods, interconnect methods, etc.
• Perform technical design reviews at various stages of the product development, and modify existing designs to improve performance, quality, manufacturability, production yields, etc.
• Perform thorough peer review of designs to help team minimize defects.
• Maintain accurate and complete documentation and archive design files for all products by working with internal documentation control systems and guidelines.
• Assist in qualification of new contract manufacturers, as well as lead collaboration to improve assembly yields and reduce manufacturing cost.
• Efficiently solve operational and material issues as they arise.
• Assist in FA activities as relates to the manufacturing process during qualification and on customer RMAs.
• Comply with documented departmental and corporate procedures and recommend changes/ improvements to procedures.

The duties, responsibilities and expectations described above are not a comprehensive list and additional tasks may be assigned to the member, within the scope of the position.

Qualifications

Education

• BSME and 7+ years of industry engineering experience, with at least 3 years of semiconductor packaging and/or process development.
• MSME or equivalent preferred.

Job Knowledge, Skills and Competencies

• Competent in microwave and milli-meter wave packaging, manufacturing and process development.
• Must have strong knowledge of microelectronic chip-and-wire manufacturing methods and techniques, including: wedge bonding, ball bonding, silver epoxy application, expansion coefficient and thermal conductivity of materials, plating, hard and soft substrate materials, printed circuit board manufacturing methods and techniques.
• Must have ability to use 2D and 3D CAD software (e.g. AutoCAD, Draftsight, Inventor, SolidWorks, etc.).
• Business related computer skills including strong working knowledge of Microsoft Office.
• Professional and positive approach, self-motivated, strong in building relationships, team player, dynamic, creative with the ability to work on own initiative.
• Demonstrated strong oral and written communication skills.
• Strong relationship management, strategy development, project management, problem solving and change management skills.
• Manage diverse, simultaneous projects of varying complexities.

Physical Demands

The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. While performing the duties of this job, the employee is regularly required to talk and hear. The employee frequently is required to stand, walk, sit and use hands to operate a computer keyboard. The employee is occasionally required to reach with hands and arms. The employee must occasionally lift and/or move up to 10 pounds. Specific vision abilities required by this job include close vision, and ability to adjust focus. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

Cultural Focus

• Displays enthusiasm and Passion for their work
• Works to the standard of Uncompromising Quality by meeting or exceeding stated objectives and embracing continuous improvement
• Exercises sound Business Judgement, ensuring that efforts are on track with the Company’s goals
• Operates with the mindset of Customer Obsession – by meeting or exceeding expectations to both internal and external customers
• Takes Accountability by taking ownership and accepting responsibility for their conduct and contributions
• Demonstrates a strong sense of urgency and accomplishes tasks with Speed and attention to detail
• Cooperates, collaborates and contributes to shared goals with a strong sense of Teamwork
• Conducts themselves with Honesty & Integrity and treats all members with Trust & Respect

Additional Requirements/Skills

• Comply, understand, and support corporate safety initiatives to ensure a safe work environment
• Ability and willingness to abide by Company’s Code of Conduct

Disclaimer: The listed qualifications and requirements for each position are intended as guidelines. Mini-Circuits reserves the right to hire outside of these guidelines at Management’s discretion.

Mini-Circuits is an Equal Opportunity Employer and does not discriminate on the basis of actual or perceived age, race, creed, color, national origin, sexual orientation, military status, sex, disability, predisposing genetic characteristics, marital status, familial status, gender identity, gender dysphoria, pregnancy-related condition, and domestic violence victim status or protected class characteristic, or any other protected characteristic as established by federal or state law.

Disclaimer: The listed qualifications and requirements for each position are intended as guidelines. Mini-Circuits reserves the right to hire outside of these guidelines at Management’s discretion.

Mini-Circuits is an Equal Opportunity Employer and does not discriminate on the basis of actual or perceived age, race, creed, color, national origin, sexual orientation, military status, sex, disability, predisposing genetic characteristics, marital status, familial status, gender identity, gender dysphoria, pregnancy-related condition, and domestic violence victim status or protected class characteristic, or any other protected characteristic as established by federal or state law.