Senior Microelectronics Failure Analysis Engineer

Spacex; Bastrop (TX); On-site; USD 120,000 - 180,000; Full time

Job summary

SpaceX is seeking a Sr. Failure Analysis Engineer, Microelectronics (Starlink) to perform root cause analysis on microelectronic components for high-volume manufacturing and field returns.

You will use advanced tools to locate defects and determine failure mechanisms, driving corrective actions with cross-functional teams. You will apply physics-of-failure concepts to electromigration, thermal fatigue, delamination, ESD, and solder joint fatigue, contributing to reliability improvements across

Qualifications

• Bachelor's degree in STEM fields with hands-on FA experience.
• Master's/PhD preferred for advanced roles in microelectronics.
• Experience with JEDEC and AEC reliability methodologies is a plus.

Responsibilities

• Own end-to-end root cause failure analysis investigations on microelectronics in manufacturing, test, and field.
• Conduct advanced electrical fault isolation and characterization to localize defects.
• Perform physical FA using SEM, FIB, EDS, cross-sectioning to identify failure mechanisms.
• Apply physics-of-failure to determine root causes and suggest corrective actions.
• Collaborate with design, packaging, and manufacturing teams to validate changes.
• Author detailed technical reports on failure modes and corrective actions.
• Develop FA techniques and workflows for new packaging technologies.

Skills

Failure analysis

Semiconductor physics

Electrical characterization

Python

Data analysis

Education

Bachelor's degree in materials science / electrical engineering / physics

Master's or PhD in related field (preferred)

Tools

SEM

FIB

EDS

Cross-sectioning

OBIRCH/EBIRCH

Nanoprobing

IV curves

RF/VNA

LIT

Job description

SpaceX is seeking a Sr. Failure Analysis Engineer, Microelectronics (Starlink) to perform root cause analysis on microelectronic components for high-volume manufacturing and field returns.

You will use advanced tools to locate defects and determine failure mechanisms, driving corrective actions with cross-functional teams. You will apply physics-of-failure concepts to electromigration, thermal fatigue, delamination, ESD, and solder joint fatigue, contributing to reliability improvements across