Senior Metallization Process Engineer (Electroplating)

Syenta; Tempe (AZ); On-site; USD 110,000 - 170,000; Full time

Benefits offered by this job

Competitive Salary

Equity opportunities

401(k) and other benefits

Health, dental, and vision coverage

Professional Growth

Team Events

Work-Life Balance

15 days PTO and 10 days sick leave

Job summary

Syenta is seeking a Process Engineer (Metallization) to own electroplating processes within the LEM platform. You will design experiments, optimize chemistries, and translate learnings into repeatable workflows driving high‑quality metallization for advanced packaging.

The role requires 5+ years in electroplating or electrochemical development, with strong copper deposition experience and DOE proficiency. You’ll partner with cross‑functional teams to scale lab results toward manufacturing

Qualifications

• Bachelor’s or higher in a relevant field.
• 5+ years hands-on electroplating or process development.
• Strong copper electroplating or metal deposition experience.
• Background in semiconductor manufacturing or high-precision industries.
• Proven ability to solve complex process and defect challenges.
• Strong DOE, data analysis, and problem-solving capabilities.

Responsibilities

• Electroplating process ownership and ongoing optimization.
• Design and execute structured experiments (DOE, parameter sweeps).
• Refine electrolyte chemistries and additive systems.
• Establish process control criteria and repeatability standards.
• Translate results into actionable improvements for scale-up.
• Collaborate with materials, hardware, and product teams.

Skills

Electroplating

DOE design

Data analysis

Lab/cleanroom experience

Education

B.S., M.S., or Ph.D. in Chemistry / Electrochemistry / Materials Science / Chemical Engineering

Tools

SEM

Profilometry

Electrical testing

Job description

Syenta is seeking a Process Engineer (Metallization) to own electroplating processes within the LEM platform. You will design experiments, optimize chemistries, and translate learnings into repeatable workflows driving high‑quality metallization for advanced packaging.

The role requires 5+ years in electroplating or electrochemical development, with strong copper deposition experience and DOE proficiency. You’ll partner with cross‑functional teams to scale lab results toward manufacturing