Metallization Process Engineer — Semiconductor Electroplating (Equity)

Syenta; Arizona; Presencial; USD 120.000 - 165.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Competitive salary

Early-stage equity opportunities

Health, dental, and vision coverage

Descripción de la vacante

Syenta is seeking a Process Engineer (Metallization) to advance our Localized Electrochemical Manufacturing platform. You will own electroplating processes, design structured experiments, and drive improvements in film properties and defect reduction.

You will collaborate with cross-functional teams to scale lab breakthroughs toward manufacturing readiness. The role requires 5+ years in electroplating or electrochemical development, a strong background in copper deposition, and experience in

Formación

• B.S., M.S., or Ph.D. or equivalent in Chemistry, Electrochemistry, Materials Science, or Chemical Engineering.
• 5+ years hands-on experience in electroplating or electrochemical process development.
• Strong experience with copper electroplating or similar metal deposition systems.
• Background in semiconductor manufacturing or related high-precision industries.

Responsabilidades

• Own electroplating process development within Syenta’s LEM platform and optimize deposition windows for performance and manufacturability.
• Design and execute structured experiments (DOE, parameter sweeps) to improve yield and repeatability.
• Investigate defects (voids, seams, roughness) and implement corrective actions to reduce variability.
• Translate lab-scale results into stable, scalable manufacturing workflows and support transfer to pilot lines.

Conocimientos

DOE design

Electroplating

Electrochemistry

Materials science

Problem solving

Lab experience

Educación

Bachelor's/Master's/PhD in Chemistry or Electrochemistry or Materials Science or Chemical Engineering

Herramientas

SEM

Profilometry

Electrical testing

Descripción del empleo

Syenta is seeking a Process Engineer (Metallization) to advance our Localized Electrochemical Manufacturing platform. You will own electroplating processes, design structured experiments, and drive improvements in film properties and defect reduction.

You will collaborate with cross-functional teams to scale lab breakthroughs toward manufacturing readiness. The role requires 5+ years in electroplating or electrochemical development, a strong background in copper deposition, and experience in