Senior MEMS Packaging & Integration Engineer

Socket.dev; Santa Clara (CA); On-site; USD 180,000 - 280,000; Full time

Job summary

nEye.ai is seeking a Systems Packaging & Assembly Engineer to lead development and integration of packaging solutions for MEMS-based silicon photonics switches. You will bridge R&D and manufacturing, driving packaging from concept through high-volume production.

The ideal candidate has hands-on experience in optical modules, MEMS devices, and IC packaging, with proven ability to collaborate with OSATs, contract manufacturers, and internal teams to deliver scalable, reliable systems.

Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.
• 15+ years of experience in semiconductor or photonics packaging engineering.
• Extensive experience in IC package design and back-end assembly process development in a manufacturing environment.
• Strong background in advanced packaging technologies, such as flip-chip and wirebond hybrid assemblies.
• Experience with OSATs and contract manufacturers; leadership in NPI programs.
• Knowledge of yield improvement, failure analysis, and process development; senior contributor.

Responsibilities

• Define and codesign package substrates for MEMS-based silicon photonics optical switching systems.
• Lead package and assembly integration of complex multi-component systems including MEMS devices, photonic ICs, ASICs, substrates, and optical interfaces.
• Drive mechanical, electrical, and optical integration strategies for performance, reliability, and manufacturability.
• Collaborate with photonics, MEMS, electrical, and mechanical teams to define packaging requirements and interfaces.
• Lead New Product Introduction (NPI) activities from prototype builds through production ramp.
• Manage relationships with OSATs, contract manufacturers, and suppliers to meet product requirements.
• Oversee process qualification, yield ramp, reliability validation; implement RCA and corrective actions.
• Coordinate technology transfer from engineering to manufacturing partners; track milestones.

Skills

Semiconductor packaging

MEMS packaging

NPI programs

OSAT management

Cross-functional leadership

DOE / SPC

Education

Bachelor's or Master's in Mechanical / Electrical / Materials Science

Tools

Cadence SiP

AutoCAD

SolidWorks

Job description

nEye.ai is seeking a Systems Packaging & Assembly Engineer to lead development and integration of packaging solutions for MEMS-based silicon photonics switches. You will bridge R&D and manufacturing, driving packaging from concept through high-volume production.

The ideal candidate has hands-on experience in optical modules, MEMS devices, and IC packaging, with proven ability to collaborate with OSATs, contract manufacturers, and internal teams to deliver scalable, reliable systems.