Senior MEMS Packaging Engineer – Lead Auto Sensor Packages

Analog Devices; Wilmington (MA); On-site; USD 110,000 - 152,000; Full time

Benefits offered by this job

Medical, Vision and Dental

401k

Paid vacation and holidays

Job summary

Analog Devices, Inc. is seeking a Senior Systems Semiconductor Packaging Engineer to lead advanced packaging solutions for MEMS sensors across automotive, industrial, medical, aerospace, and defense applications.

You will contribute through the full product lifecycle, translating customer requirements into robust packaging solutions with strong technical judgment. The role requires collaboration across applications, quality, reliability, manufacturing, and external vendors to improve

Qualifications

• Strong experience in semiconductor packaging and manufacturing processes.
• Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization.
• Hands-on experience with 3D CAD and engineering analysis tools.

Responsibilities

• Lead project-level semiconductor packaging design activities from product conception through manufacturing readiness.
• Drive design for manufacturability and design for reliability through process characterization, risk assessment, and structured problem solving.
• Partner with quality and reliability teams to perform root cause analysis, improve yield, and implement corrective and preventive actions.
• Perform detailed package analysis using 3D CAD tools such as SolidWorks and simulation tools such as ANSYS to evaluate mechanical and process performance.
• Apply engineering methodologies including control plans, PFMEA, DOE, SPC, 8D, and RCA to improve product and process outcomes.
• Translate customer specifications into clear technical direction for internal development teams
• Work with OSAT partners to support rapid prototyping, early builds, and preliminary qualification activities
• Align package designs with vendor assembly capabilities and manufacturing constraints
• Collaborate with multidisciplinary teams to support execution and product success across development phases

Skills

Semiconductor Packaging

Materials Knowledge

Design for Reliability

Simulation Tools

Structured Problem Solving

Cross-Functional Collaboration

Technical Communication

Education

Bachelor’s or Master’s degree in Mechanical Engineering/ Materials Science/ Electrical Engineering

Tools

SolidWorks

ANSYS

Job description

Analog Devices, Inc. is seeking a Senior Systems Semiconductor Packaging Engineer to lead advanced packaging solutions for MEMS sensors across automotive, industrial, medical, aerospace, and defense applications.

You will contribute through the full product lifecycle, translating customer requirements into robust packaging solutions with strong technical judgment. The role requires collaboration across applications, quality, reliability, manufacturing, and external vendors to improve