Senior Memory Design Engineer, HBM

Micron Technology, Inc.

Richardson (TX)

On-site

USD 120,000 - 180,000

Full time

9 days ago
Application generator

An application made for this job — a tailored resume and cover letter that speak straight to the posting.

Get past ATS filters

Benefits offered by this job

Medical, dental, and vision plans
Paid time off
Paid holidays

Job summary

Micron Technology, Inc. in Richardson, Texas, seeks a Senior Design Engineer to design, simulate, and optimize DRAM circuits and support digital/analog circuitry development for advanced memory products.

You will collaborate globally across design, verification, product engineering, test, and manufacturing to deliver manufacturable, cost-optimized solutions. The role requires coursework in CMOS, VLSI and analog design, proficiency with Cadence Virtuoso and simulators (FINESIM, HSPICE, Verilog),

Qualifications

  • Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design.
  • Experience with Cadence Virtuoso and circuit simulators (FINESIM, HSPICE, Verilog).
  • Strong analytical and problem-solving skills with proven technical contributions.
  • DRAM subsystem experience or design knowledge and leadership.

Responsibilities

  • Design digital, analog, and memory core circuits from concept to solution.
  • Use AI-enabled tools to assist with schematic editing and layout planning.
  • Prepare floorplans for placement, routing, and power delivery, including layout leadership.
  • Simulate circuits and analyze power, performance, and reliability.
  • Validate builds and lead design reviews to communicate progress.

Skills

CMOS Circuit Design
VLSI
Analog Circuit Design
Cross-functional leadership
Analytical thinking

Education

BS/MS in Electrical Engineering

Tools

Cadence Virtuoso
FINESIM
HSPICE
Verilog

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Senior Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment.

Responsibilities
  • Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution.

  • Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan.

  • Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership.

  • Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts.

  • Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits.

  • Prepare and maintain design documentation while contributing to best‑known practices and departmental training.

  • Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality.

  • Manage layout and develop resources, track project tasks, and serve as the point of contact for design, layout, verification, and test issues.

  • Prepare project status reports and lead design reviews to communicate progress and technical decisions.

Qualifications
  • Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with understanding of device reliability and circuit floor planning.

  • Proficiency with Cadence Virtuoso, and experience simulating with FINESIM, HSPICE, and VERILOG.

  • Strong analytical and problem‑solving skills with proven significant technical contributions and a record of innovation.

  • Expertise in DRAM subsystem architecture, specification, operation, or design, including cross‑department technical leadership experience.

  • Ability to proactively collaborate across multiple engineering organizations to optimize manufacturing quality, cost, reliability, and time‑to‑market.

Preferred Qualifications
  • Self‑motivated with strong problem‑solving abilities and a drive to discover new solutions.

  • Deep knowledge of industry‑specific technologies and competitive trends.

  • Excellent communication and interpersonal skills for cross‑functional collaboration.

  • BS or MS in Electrical Engineering or related field plus 3-5 years of experience in DRAM design, product, or system.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

AI alert : Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Senior Memory Design Engineer, HBM
Senior Memory Design Engineer, HBM

Micron Technology, Inc • Richardson (TX)

On-site
USD 120,000 - 160,000
Senior Design Engineer, HBM
Senior Design Engineer, HBM

Micron Technology, Inc • Richardson (TX)

On-site
USD 120,000 - 160,000
Medical/Dental/Vision
Paid time off
Paid holidays
Principal Memory Design Engineer, HBM
Principal Memory Design Engineer, HBM

Micron Technology Inc • Richardson (TX)

On-site
USD 140,000 - 200,000
Circuit / Memory Design Engineer | HBM - TPG
Circuit / Memory Design Engineer | HBM - TPG

Micron Technology • Richardson (TX)

On-site
USD 120,000 - 170,000
Principal Memory Design Engineer, HBM
Principal Memory Design Engineer, HBM

Micron Technology, Inc • Richardson (TX)

On-site
USD 120,000 - 150,000
Robust paid time-off program
Paid family leave
Income protection programs
Semiconductor Design Engineer, DRAM: Senior, Staff, or Principal
Semiconductor Design Engineer, DRAM: Senior, Staff, or Principal

Micron • Boise (ID)

On-site
USD 90,000 - 150,000
Relocation assistance
Comprehensive benefits
Paid time off
Memory Design Engineer, HBM
Memory Design Engineer, HBM

Micron Technology, Inc • Richardson (TX)

On-site
USD 80,000 - 100,000
Choice of medical, dental, and vision plans
Paid family leave
Robust paid time-off program and paid holidays
New College Grad - Semiconductor Design Engineer
New College Grad - Semiconductor Design Engineer

Micron Technology • Boise (ID)

On-site
USD 120,000 - 180,000
Medical, dental, vision plans
Paid time off
Paid holidays
Memory Design Engineer, HBM
Memory Design Engineer, HBM

1000 Micron Technology, Inc. • Richardson (TX)

On-site
USD 80,000 - 110,000
Medical, dental, and vision plans
Paid family leave
Robust paid time-off program
Principal Memory Design Engineer, HBM
Principal Memory Design Engineer, HBM

Micron • Garland (TX)

On-site
USD 150,000 - 210,000
Medical, dental & vision plans
Paid time off and holidays
Equal opportunity employer