Senior Mechanical Project Engineer - Data Center Cooling

Giga Energy; United States; Vor Ort; USD 110.000 - 170.000; Vollzeit

Zusammenfassung

Giga Energy is seeking a Senior Mechanical Project Engineer to serve as the on‑site technical representative for data center cooling and HVAC systems. The role focuses on ensuring installation aligns with design intent, resolving field issues quickly, and maintaining strong liaison between engineering and construction teams.

The ideal candidate has extensive experience with hydronic and high‑density cooling systems, including direct‑to‑chip liquid cooling, and will travel between project sites

Qualifikationen

• Bachelor’s degree in Mechanical Engineering or related field.
• 7+ years of mechanical engineering experience with hydronic/HVAC design, construction, or commissioning.
• Strong knowledge of hydronic systems, piping, pumps, heat exchangers, controls, and HVAC load calculations.

Aufgaben

• Serve as the on‑site Design Engineering representative throughout construction, startup, and commissioning.
• Oversee hydronic and data center cooling systems, including direct‑to‑chip liquid cooling and CDUs.
• Provide technical oversight for office and support‑space HVAC systems and ensure codes and design intent are met.
• Review submittals, coordinate with contractors, and resolve field conflicts.
• Support commissioning, testing, and startup activities and verify system performance.

Kenntnisse

Hydronic design

HVAC load calculations

Piping & hydraulics

Field troubleshooting

Communication

Travel readiness

Ausbildung

Bachelor’s degree in Mechanical Engineering

Tools

Revit

Navisworks

Jobbeschreibung

Giga Energy is seeking a Senior Mechanical Project Engineer to serve as the on‑site technical representative for data center cooling and HVAC systems. The role focuses on ensuring installation aligns with design intent, resolving field issues quickly, and maintaining strong liaison between engineering and construction teams.

The ideal candidate has extensive experience with hydronic and high‑density cooling systems, including direct‑to‑chip liquid cooling, and will travel between project sites