Senior Manufacturing Engineer, Thermal & Semiconductor Packaging

Coherent Corp.

Pennsylvania

On-site

USD 90,000 - 150,000

Full time

14 days+
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Job summary

Coherent Corp. in the United States is seeking an experienced Manufacturing Engineer to support process development and scale-up for advanced thermal management products, including semiconductor packaging hardware and liquid cooling components.

You will lead pilot builds, develop routings and work instructions, partner with engineering and operations to identify manufacturability risks, and drive improvements in yield and cycle time across multiple manufacturing steps.

Qualifications

  • Minimum 7–10 years in manufacturing/process engineering for semiconductors or related fields.
  • Experience with pilot builds, process development, and scale-up.
  • Strong knowledge of machining, metallization, bonding, testing processes.
  • BS/MS degree as listed.

Responsibilities

  • Develop manufacturing process flows, routings, work instructions and inspection plans.
  • Lead production readiness and pilot builds for thermal management products.
  • Identify manufacturability risks, yield issues, and cost drivers with cross-functional teams.
  • Support transition of development processes into controlled manufacturing processes.
  • Drive yield improvements, cycle-time reduction, and process repeatability.
  • Collaborate with suppliers and internal teams for machining, bonding, cleaning, and assembly.
  • Support capital planning and equipment validation activities.
  • Ensure processes meet customer qualification and ISO standards where applicable.

Skills

Manufacturing Engineering
Process Development
NPI / New Product Introduction
Reliability / Qualification planning
Cross-functional collaboration
Manufacturing readiness

Education

BS/MS in Mechanical Engineering or related

Job description

Coherent Corp. in the United States is seeking an experienced Manufacturing Engineer to support process development and scale-up for advanced thermal management products, including semiconductor packaging hardware and liquid cooling components.

You will lead pilot builds, develop routings and work instructions, partner with engineering and operations to identify manufacturability risks, and drive improvements in yield and cycle time across multiple manufacturing steps.

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