Senior Imaging Hardware Engineer – High-Speed PCB

Fairchild Imaging; San Jose (CA); Hybrid; USD 180,000 - 200,000; Full time

Benefits offered by this job

9/80 Schedule

Medical Insurance

Dental & Vision

Health Savings Account

401(k) with employer match

Tuition Reimbursement

Paid Time Off

Job summary

Fairchild Imaging is seeking a Senior Hardware Design Engineer to lead the development of high‑speed PCB platforms for CMOS image sensors and X‑ray camera systems. You will drive hardware choices, optimize signal integrity, and collaborate with sensor, firmware, and software teams to ensure top imaging performance.

The role requires hands-on leadership, mentoring, and design reviews, with a focus on robust USB-C interoperability, EMI/EMC mitigation, and power integrity across sensor interfaces.

Qualifications

• BS/MS in Electrical Engineering or related field.
• 8+ years of hardware design experience with complex multilayer PCBs.
• Proven expertise in high-speed digital systems and high-density PCBs.
• Strong hands-on lab debugging with oscilloscopes and analyzers.
• Experience with CMOS image sensor integration and board-level camera development.

Responsibilities

• Provide technical leadership across hardware development programs for imaging and sensor products.
• Mentor junior and mid-level hardware engineers in schematic design and PCB layout.
• Lead hardware design reviews and cross-functional technical decisions.
• Establish and promote standards for high-speed PCB design, SI, documentation, and validation.
• Support project planning, resource estimation, and execution tracking for hardware activities.

Skills

High-speed design

PCB design

Signal integrity

Team leadership

CMOS image sensor integration

Hardware architecture

Design reviews

Education

BS/MS in Electrical Engineering

Tools

Altium Designer

Cadence Allegro

Oscilloscopes

Protocol analyzers

Logic analyzers

Job description

Fairchild Imaging is seeking a Senior Hardware Design Engineer to lead the development of high‑speed PCB platforms for CMOS image sensors and X‑ray camera systems. You will drive hardware choices, optimize signal integrity, and collaborate with sensor, firmware, and software teams to ensure top imaging performance.

The role requires hands-on leadership, mentoring, and design reviews, with a focus on robust USB-C interoperability, EMI/EMC mitigation, and power integrity across sensor interfaces.