Senior HBM Datapath Architect - High-Speed Systems

Micron Technology, Inc; Boise (ID); On-site; USD 120,000 - 160,000; Full time

Benefits offered by this job

Choice of medical, dental, and vision plans

Paid family leave

Robust paid time-off program

Job summary

A leading semiconductor company is seeking a Sr Design Architect in Boise, Idaho, to architect and design high-speed datapath circuitry for next-generation High Bandwidth Memory products. The role involves determining system specifications and debugging while working collaboratively in a dynamic team environment. Candidates should possess a relevant degree and significant experience in the field. Micron offers competitive benefits and a supportive workplace environment.

Qualifications

• 4+ years of relevant industry experience.
• Experience architecting, designing, or optimizing circuitry.
• Ability to define and implement complex system requirements.

Responsibilities

• Architect, design, and optimize datapath circuitry.
• Determine system specifications and processes.
• Coordinate subsystem design across teams.

Skills

High-speed datapath circuitry

Architecting

Designing

Optimizing

Education

Bachelor’s degree in Electrical Engineering

Master's or PhD in relevant field

Tools

CAD Software

Job description

A leading semiconductor company is seeking a Sr Design Architect in Boise, Idaho, to architect and design high-speed datapath circuitry for next-generation High Bandwidth Memory products. The role involves determining system specifications and debugging while working collaboratively in a dynamic team environment. Candidates should possess a relevant degree and significant experience in the field. Micron offers competitive benefits and a supportive workplace environment.