Senior Hardware Lead, Lidar Systems

Ouster; San Francisco (CA); On-site; USD 154,000 - 230,000; Full time

Benefits offered by this job

Equity

Benefits

Job summary

Ouster, a leader in LIDAR sensors, seeks a senior hardware leader to drive system architecture and bring designs from concept to volume production.

You will lead hardware development for high-integrated assemblies, ensure performance under size, weight, and power constraints, and coordinate with firmware and manufacturing to deliver world-class sensor systems. A strong background in embedded SoCs and HDI PCB design is required.

Qualifications

• 12+ years in designing, testing, and delivering complex electrical designs.
• Expert knowledge of analog and digital circuits.
• Experience architecting embedded SoC systems (DSP+ARM or FPGA+ARM) with Ethernet, CAN, I2C, SPI, USB.
• Proficient with Altium and HDI PCB design for series production.
• Able to manage multiple projects across lifecycle and document requirements thoroughly.

Responsibilities

• Lead hardware development for LIDAR hardware, drive system architecture from concept to production.
• Break ground in design and validation under size, weight, power, and functionality constraints.
• Own the hardware lifecycle from requirements to bring-up and high-volume production.
• Identify and solve complex hardware failures with root-cause analysis.
• Collaborate across hardware, firmware, and manufacturing teams to deliver integrated sensor systems.

Skills

Embedded SoC design

HDI PCB design

Altium CAD

Ethernet/CAN/I2C/SPI/USB

Analog & digital circuits

Project leadership

Tools

HDI anylayer

Rigid-flex PCBs

Multi-layer PCB fabrication

Job description

Ouster, a leader in LIDAR sensors, seeks a senior hardware leader to drive system architecture and bring designs from concept to volume production.

You will lead hardware development for high-integrated assemblies, ensure performance under size, weight, and power constraints, and coordinate with firmware and manufacturing to deliver world-class sensor systems. A strong background in embedded SoCs and HDI PCB design is required.