Senior Hardware Failure Analysis Engineer

The Rundown AI, Inc.; Sunnyvale (CA); On-site; USD 80,000 - 110,000; Full time

Job summary

An innovative AI Robotics company is seeking a Failure Analysis Engineer to lead hardware failure investigations for their humanoid robots. This role is crucial in ensuring product reliability and involves analyzing failures using advanced techniques like SEM, CT X-ray, and optical inspection. The ideal candidate will have a strong background in hardware analysis and be adept at collaborating with cross-functional teams to drive root cause investigations. Join a forward-thinking team dedicated to pushing the boundaries of robotics technology and making a significant impact in the industry.

Qualifications

• 5+ years experience in hardware failure analysis in relevant industries.
• Strong understanding of failure concepts and mechanisms.

Responsibilities

• Analyze hardware failures and ensure reliability targets are met.
• Setup hardware failure analysis lab and perform various analyses.

Skills

Hardware Failure Analysis

Mechanical Cross Sectioning

Optical Inspection

SEM/EDS

CT X-ray Interpretation

FTIR

Laser Induced Breakdown Spectroscopy

Fault Isolation

Root Cause Analysis

Education

Bachelor's Degree in Engineering

Tools

Keyence Equipment

VGStudio

DMM

Lock-in IR Thermography

Oscilloscope

Probe Station

Function Generator

IV-Tracing

TDR

Job description

Figure is an AI Robotics company developing a general purpose humanoid. Our humanoid robot, Figure 02, is designed for commercial tasks and the home. We are based in San Jose, CA and require 5 days/week in-office collaboration. It’s time to build.

We are looking for a Failure Analysis (FA) Engineer to be in charge of analyzing hardware failures from product development and field uses to ensure that issues are addressed to meet our product reliability targets. We are looking for someone with a strong FA background who possesses comprehensive FA skills and is able to execute end-to-end failure analysis at components (e.g. PCBAs, actuators, battery cells), modules (e.g. hand), and system (robot) levels.

Responsibilities:

1. Mechanical Cross sectioning of PCBAs
2. Perform Optical Inspection (Keyence equipment preferred)
3. Perform SEM/EDS and interpret the result
4. Perform CT X-ray and interpret the CT X-ray data (VGStudio experience preferred)
5. Perform FTIR and interpret result
6. Perform Laser Induced Breakdown Spectroscopy (LIBS) and interpret result
7. Dissemble different DUTs and perform fault isolation
8. Setup hardware failure analysis lab
9. Triage failures and write FA SOPs
10. Work alongside cross functional teams to identify the root cause of HW failure
11. Drive HW failure analysis at the component level at vendors
12. Utilize DMM, Lock-in IR thermography, oscilloscope, probe station, function generator, IV-Tracing, or TDR to perform PCBAs level analysis

Requirements:

1. Minimum 5 year experience in hardware failure analysis in the automotive, consumer electronics, aerospace or robotics industry
2. Understand the basic operations of mechanical cross sectioning, optical microscope, SEM/EDS, CT Xray, FTIR, and Confocal Scanning Acoustic Microscope (CSAM)
3. Advanced understanding of failure concepts and mechanisms, such as fatigue, ductile brittle, adhesive/cohesive, contamination, intermetallic compounds, corrosion

Bonus Qualification:

1. Experience of GCMS
2. Experience of different etching techniques
3. Experience of X-ray Photoelectron Spectroscopy
4. Experience of Differential Scanning Calorimetry and TMA
5. Experience of Gel Permeation Chromatography
6. Experience of Instron and DMA
7. Experience in building a failure analysis laboratory