Senior Front End Manufacturing Alignment Lead

Micron Memory Malaysia Sdn Bhd; Boise (ID); On-site; USD 170,000 - 240,000; Full time

Job summary

Micron Technology in Boise, Idaho is seeking a Senior Manager for Front End Manufacturing Alignment to lead the MAE team and TPM program managers across global sites. You will drive strategic roadmaps, performance metrics, and cross-site collaboration to ensure safety, cost, quality, output, and yield targets are met.

The role requires a Bachelor's degree in engineering, 5+ years leading semiconductor teams, and experience with TPM/SEAL systems. Extensive travel to US HVM sites is expected.

Qualifications

• Bachelor's Degree in Engineering or related field required.
• Minimum 5 years of experience leading a team in the semiconductor industry.
• Minimum 2 years of experience in Process and Equipment in at least one fab functional group.

Responsibilities

• Set annual strategies and align KPIs for network performance improvements; review site progress and close gaps.
• Attend strategic site meetings, conduct quarterly reviews, publish monthly performance reports, and manage MAE programs.
• Govern MAE Programs and cross-pillar processes; sponsor and coach new program development with Alignment Engineers.
• Sustain TPM 2.0 program; deploy TPM methodologies; lead labor efficiency initiatives and metrics to improve equipment performance.
• Lead the F4 Manufacturing alignment team to support site expansion and qualification; facilitate fab tool installations and new tech startups.

Job description

Micron Technology in Boise, Idaho is seeking a Senior Manager for Front End Manufacturing Alignment to lead the MAE team and TPM program managers across global sites. You will drive strategic roadmaps, performance metrics, and cross-site collaboration to ensure safety, cost, quality, output, and yield targets are met.

The role requires a Bachelor's degree in engineering, 5+ years leading semiconductor teams, and experience with TPM/SEAL systems. Extensive travel to US HVM sites is expected.