Senior Fab Process Engineering Leader (Semiconductor)

Raxium

Fremont (CA)

On-site

USD 180,000 - 240,000

Full time

29 hours ago
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Job summary

Raxium seeks an experienced semiconductor process engineer with a strong track record in high-volume wafer fabrication. The role emphasizes leadership across engineering teams, process robustness, and cross-functional collaboration to advance device fabrication and integration.

The ideal candidate has 10 years in process engineering, plus 7 years in leadership, and may hold a PhD. Expertise in lithography, bonding, CMP, and plasma processing is highly valued, with a data-driven problem-solving

Qualifications

  • Master's degree or equivalent practical experience in a related field.
  • 10 years of experience in semiconductor process engineering in wafer fabrication.
  • 7 years of technical leadership experience.
  • PhD in a related field is preferred.
  • Six Sigma Black Belt is preferred.
  • 15 years of experience in semiconductor process engineering in high-volume wafer fabrication is preferred.
  • Experience in device fabrication and process integration of optoelectronics devices is preferred.
  • Robust process strategy development and cross-functional leadership experience is preferred.
  • Strong problem-solving, data query and analysis skills are preferred.

Skills

Semiconductor process engineering
Technical leadership
Data analysis

Education

Master's degree in Electrical Engineering, Physics, Materials Science, Chemistry or related field
Ph.D in Electrical Engineering, Physics, Materials Science, Chemistry or related field

Tools

Patterning & Lithography
Wafer Bonding
CMP
Wet chemical processing
Plasma processing

Job description

Raxium seeks an experienced semiconductor process engineer with a strong track record in high-volume wafer fabrication. The role emphasizes leadership across engineering teams, process robustness, and cross-functional collaboration to advance device fabrication and integration.

The ideal candidate has 10 years in process engineering, plus 7 years in leadership, and may hold a PhD. Expertise in lithography, bonding, CMP, and plasma processing is highly valued, with a data-driven problem-solving

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