Fab Process Engineering Lead, Raxium

Raxium; Fremont (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

Raxium seeks an experienced semiconductor process engineer with a strong track record in high-volume wafer fabrication. The role emphasizes leadership across engineering teams, process robustness, and cross-functional collaboration to advance device fabrication and integration.

The ideal candidate has 10 years in process engineering, plus 7 years in leadership, and may hold a PhD. Expertise in lithography, bonding, CMP, and plasma processing is highly valued, with a data-driven problem-solving

Qualifications

• Master's degree or equivalent practical experience in a related field.
• 10 years of experience in semiconductor process engineering in wafer fabrication.
• 7 years of technical leadership experience.
• PhD in a related field is preferred.
• Six Sigma Black Belt is preferred.
• 15 years of experience in semiconductor process engineering in high-volume wafer fabrication is preferred.
• Experience in device fabrication and process integration of optoelectronics devices is preferred.
• Robust process strategy development and cross-functional leadership experience is preferred.
• Strong problem-solving, data query and analysis skills are preferred.

Skills

Semiconductor process engineering

Technical leadership

Data analysis

Education

Master's degree in Electrical Engineering, Physics, Materials Science, Chemistry or related field

Ph.D in Electrical Engineering, Physics, Materials Science, Chemistry or related field

Tools

Patterning & Lithography

Wafer Bonding

CMP

Wet chemical processing

Plasma processing

Job description

• Master's degree in Electrical Engineering, Physics, Materials Science, Chemistry or a related field or equivalent practical experience.
• 10 years of experience in semiconductor process engineering in semiconductor wafer fab manufacturing (e.g., patterning and lithography, wafer bonding and CMP, wet chemical processes, plasma processing, etc.).
• 7 years of technical leadership experience.

Minimum Qualifications

• Master's degree in Electrical Engineering, Physics, Materials Science, Chemistry or a related field or equivalent practical experience.
• 10 years of experience in semiconductor process engineering in semiconductor wafer fab manufacturing (e.g., patterning and lithography, wafer bonding and CMP, wet chemical processes, plasma processing, etc.).
• 7 years of technical leadership experience.

Preferred Qualifications

• Ph.D in Electrical Engineering, Physics, Materials Science, Chemistry or a related or field equivalent practical experience.
• Black belt of six sigma practitioner.
• 15 years of experience in semiconductor process engineering in high-volume semiconductor wafer fab manufacturing.
• Experience in device fabrication and process integration of semiconductor optoelectronics devices.
• Fab technical leadership experience defining the process robustness strategy and execution, managing engineering cross-functions, influencing senior stakeholders, and managing executive communication.
• Expertise in structured problem-solving, data query and analysis.