Senior Embedded AI Lab Lead for TinyML & DSP Prototyping

SmartRecruiters, Inc.; Columbia (MD); On-site; USD 140,000 - 185,000; Full time

Benefits offered by this job

Medical insurance

Health Savings Account

Dental insurance

Vision insurance

Flexible spending accounts

Commuter benefits

Life insurance

AD&D

Pet insurance

Paid time off

Job summary

Renesas Electronics is seeking a Sr. Staff Embedded Applications Engineer to lead our TinyML Lab in Columbia, MD. You will head the physical lab, supervise PoCs and R&D hardware builds, and mentor engineers while pushing edge AI on Renesas silicon.

You’ll deploy DSP pipelines and TinyML models on ARM Cortex‑M and Renesas RA/RX/RL78 devices, using CMSIS‑NN and TFLite Micro. This role demands hands‑on prototyping, signal processing, and cross‑BU collaboration.

Qualifications

• MS or PhD in Electrical Engineering or related field.
• 7+ years of embedded software and hardware prototyping.
• Experience deploying TinyML on microcontrollers.

Responsibilities

• Lab ownership and technical leadership for the physical prototyping lab.
• Lead hands-on assembly of prototype rigs and sensor arrays.
• Instrument high-frequency sensor data and preprocess datasets.
• Design DSP feature extraction and deploy quantized ML models on MCUs.
• Collaborate with customers and cross‑BU teams to integrate solutions.
• Mentor junior lab engineers in firmware debugging and fabrication.

Skills

Embedded firmware

C/C++

RTOS

DSP

TinyML

Lab leadership

Education

MS in EE

PhD in EE

BSEE

Tools

FreeRTOS

Zephyr

CMSIS-NN

TFLite Micro

SPI/I2C/UART

JTAG/SWD

Job description

Renesas Electronics is seeking a Sr. Staff Embedded Applications Engineer to lead our TinyML Lab in Columbia, MD. You will head the physical lab, supervise PoCs and R&D hardware builds, and mentor engineers while pushing edge AI on Renesas silicon.

You’ll deploy DSP pipelines and TinyML models on ARM Cortex‑M and Renesas RA/RX/RL78 devices, using CMSIS‑NN and TFLite Micro. This role demands hands‑on prototyping, signal processing, and cross‑BU collaboration.