Senior Electronics Quality Engineer, Remote- Contract Remote (United States)

Dover; Northern (KY); Hybrid; USD 83,000 - 131,000; Full time

Job summary

Dover is seeking a Senior Electronics Quality Engineer for a remote contract role. The candidate will lead IPC 610/620 inspections, review PCB CAM and Gerber data, and analyze SMT/AOI defects to prevent false calls while applying AS6081 counterfeit part screening.

The role also covers semiconductor package inspection with C-SAM and X-ray, MIL-STD-883 checks, and reporting findings to stakeholders. Strong documentation and collaboration with AI dataset teams are required.

Qualifications

• Experience with IPC-A-610 and IPC/WHMA-A-620 inspection criteria.
• Gerber data review for manufacturability and quality assurance.
• Defect analysis for SMT and AOI, including false calls root cause analysis.
• Counterfeit component screening per AS6081 and risk mitigation.
• Semiconductor package inspection using C-SAM and X-ray with MIL-STD-883 checks.

Responsibilities

• Review PCB CAM and Gerber files for manufacturability, quality and standards compliance.
• Conduct IPC 610/IPC 620 visual inspections and provide feedback on PCB assemblies or harness builds.
• Document SMT and AOI defect types and perform root cause analysis of false calls.
• Apply AS6081 counterfeit part detection to deliver risk mitigation insights.
• Perform C-SAM and X-ray inspections of semiconductor packages and MIL-STD-883 checks.
• Prepare concise reports and present findings to technical and non-technical stakeholders.
• Collaborate with project leads to refine workflows and training data for AI development.

Skills

IPC 610 & IPC 620 inspection

PCB CAM & Gerber review

SMT/AOI defect analysis

Counterfeit parts detection (AS6081)

Semiconductor package inspection (C-SM

Job description

Role Title: Senior Electronics Quality Engineer

Role Type: Contract

Location: Remote

Required Skills:

• IPC 610 & IPC 620 Inspection
• PCB CAM & Gerber Review
• SMT/AOI Defect Analysis
• Counterfeit Parts Detection (AS6081)
• Semiconductor Package Inspection (C SAM and X ray)

In this role, you'll apply your expertise to help train next-generation AI systems. Your work will shape how models learn, reason, and perform through high-quality, real-world input. No prior experience in AI is required — your domain knowledge is what matters.

Scope of Work:

• Review and evaluate PCB CAM and Gerber files for manufacturability, quality, and compliance with industry standards.
• Perform IPC 610 and IPC 620 visual inspections and provide detailed feedback on PCB assembly or wire harness builds.
• Analyze and document surface mount (SMT) and automated optical inspection (AOI) defect types, including the identification and root cause analysis of AOI false calls.
• Apply expertise in counterfeit electronic part detection aligned with AS6081 standards, delivering actionable insights for risk mitigation.
• Conduct and interpret advanced semiconductor package inspections using C-SAM and X-ray imaging, including die inspection and MIL-STD-883 compliance checks.
• Prepare concise, well-written reports and articulate findings verbally to both technical and non-technical stakeholders.
• Collaborate with project leads to refine workflow processes and enhance training datasets for AI development.

Preferred Qualifications:

• 8+ years of hands-on experience in electronics quality, CAM engineering, or failure analysis, specifically within PCB assembly, wire harness, or semiconductor packaging domains.
• Extensive expertise in IPC-A-610 and IPC/WHMA-A-620 inspection criteria; IPC CIS/CIT certification strongly preferred.
• Demonstrated experience reviewing Gerber data and utilizing PCB CAM software for manufacturability and quality assurance.
• Proficiency in SMT processes, AOI defect analysis, and remediation of false calls in automated inspection systems.
• Direct involvement in counterfeit component screening per AS6081, with knowledge of risk indicators and mitigation strategies.
• Hands-on skills with semiconductor inspection tools such as C-SAM and X-ray, alongside familiarity with MIL-STD-883 procedures.
• Exceptional written and verbal communication skills, ensuring clarity in documentation and knowledge transfer.