Senior Electronics Packaging Engineer: Thermal & Rugged Enclosures

Wabtec Corporation; Erie (Erie County); On-site; USD 105,000 - 149,000; Full time

Benefits offered by this job

Performance bonus

Relocation assistance

Health benefits

Job summary

Wabtec Corporation is seeking a Senior Engineer to lead the mechanical packaging design of rugged electronic assemblies for locomotives and mining equipment. You will collaborate across electrical, systems, and manufacturing teams to meet stringent thermal, environmental, and performance requirements.

You will create FE models, perform thermal simulations, and optimize enclosures and panel architectures for manufacturability and cost targets. Travel up to 10% is required.

Qualifications

• Bachelor’s degree in Mechanical Engineering or related field.
• 10+ years of experience designing mechanical packaging for electronic products.
• Proficiency with 3D CAD software (Siemens NX preferred).
• Experience with thermal and structural analysis tools (ANSYS, Icepak, CFD).
• Knowledge of PCB integration, connectors, and interconnect systems.
• Understanding of thermal management, EMC, shock and vibration for rugged electronics.
• Experience with manufacturing support, validation, and design for manufacturability.
• Willingness to travel up to 10%.

Responsibilities

• Lead mechanical packaging design of complex electronic assemblies.
• Create and evaluate thermal, structural, and vibration requirements.
• Perform thermal simulations and cooling method trade studies.
• Develop assemblies, bolted joints, GD&T and tolerance analyses.
• Prepare drawings, BOMs, calculations, and purchas specifications.
• Lead design reviews and support supplier selection and PPAP.
• Plan and execute product validation and qualification testing.
• Drive problem solving with engineering best practices.

Skills

Problem-solving

Project management

Collaboration

Travel readiness

Education

Bachelor’s degree in Mechanical Engineering

Tools

Siemens NX

ANSYS

Icepak

CFD software

Job description

Wabtec Corporation is seeking a Senior Engineer to lead the mechanical packaging design of rugged electronic assemblies for locomotives and mining equipment. You will collaborate across electrical, systems, and manufacturing teams to meet stringent thermal, environmental, and performance requirements.

You will create FE models, perform thermal simulations, and optimize enclosures and panel architectures for manufacturability and cost targets. Travel up to 10% is required.