Senior Edge AI & Embedded Hardware Engineer

Renesas

Columbia (MD)

On-site

USD 84,000 - 105,000

Full time

9 days ago
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Benefits offered by this job

Medical insurance
Health savings account
Dental insurance
Vision insurance
Flexible spending accounts
Pre-tax commuter benefits
Life insurance
AD&D
Pet insurance
Paid time off

Job summary

Renesas is seeking a hands‑on Senior Edge AI Applications Engineer to build and deploy edge AI in a real hardware lab in Columbia, MD. You will assemble sensor rigs, run DSP pipelines, and deploy TinyML on bare‑metal silicon while debugging SPI/I2C and DSP signals.

You will mentor juniors, collaborate with customers and cross‑BU teams, and contribute to Renesas silicon with practical, lab‑level expertise in embedded firmware and sensors.

Qualifications

  • 2–3+ years of hands-on career experience in embedded software, physical hardware prototyping, and DSP.
  • Experience building physical prototype rigs and writing embedded C/C++ for microcontrollers.
  • Experience running FFTs on raw sensor data and debugging SPI/I2C with an oscilloscope.
  • Experience deploying TinyML on bare-metal silicon.
  • Strong collaboration with customers and cross‑BU teams.

Responsibilities

  • Physical Prototyping & Fabrication: Hands‑on assembly of prototype rigs, sensor arrays, 3D‑printed mounts, and microelectronic setups to capture real‑world physical data.
  • High‑Frequency Sensor Data Engineering: Instrument physical systems to capture, clean, and preprocess high‑frequency time‑series datasets (acoustic, vibration, electrical, motor current).
  • DSP & TinyML Deployment: Build DSP feature extraction pipelines and deploy quantized TinyML models onto microcontrollers using CMSIS‑NN, TFLite Micro, or eIQ.
  • Embedded Firmware Development: Write real‑time C/C++ firmware, bare‑metal or RTOS drivers, DMA management, and low‑level peripheral communication (SPI, I2C, UART, CAN).
  • Customer & Cross‑BU Collaboration: Work with customers and internal teams to ingest telemetry, debug edge firmware issues, and demonstrate hardware solutions.
  • Technical Leadership & Mentorship: Guide junior engineers, document best practices, and contribute across cross‑functional teams.

Skills

Embedded C/C++
TinyML
DSP
FFT
SPI
I2C
UART
CAN
RTOS
CMSIS-NN
TFLite Micro
eIQ
ARM Cortex-M
Renesas RA/RX/RL78

Education

B.S. or Master’s in Electrical Engineering, Computer Engineering, Applied Physics

Tools

FreeRTOS
Zephyr
JTAG/SWD
Oscilloscope

Job description

Renesas is seeking a hands‑on Senior Edge AI Applications Engineer to build and deploy edge AI in a real hardware lab in Columbia, MD. You will assemble sensor rigs, run DSP pipelines, and deploy TinyML on bare‑metal silicon while debugging SPI/I2C and DSP signals.

You will mentor juniors, collaborate with customers and cross‑BU teams, and contribute to Renesas silicon with practical, lab‑level expertise in embedded firmware and sensors.

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