Edge AI Lab Lead - Embedded DSP & TinyML Pro

Renesas Electronics; Columbia (MD); On-site; USD 140,000 - 185,000; Full time

Benefits offered by this job

Medical

Health Savings Account

Dental

Vision

Flexible spending accounts

Pre-tax commuter benefits

Life insurance

AD&D

Pet insurance

Company-paid life insurance

LTD

Paid sick time

Paid holidays

Accrued paid vacation

Job summary

Renesas Electronics in Columbia, MD is seeking a Senior Staff Edge Applications Engineer to lead our physical Edge AI lab. You will head the lab, drive PoCs, mentor junior engineers, and engineer end-to-end non-visual sensing solutions on Renesas silicon using TinyML on microcontrollers.

You'll work at the intersection of DSP, embedded firmware, and physical prototyping, shipping hardware solutions to automotive, industrial, and IoT markets. Strong leadership and hands-on skills are essential.

Qualifications

• 7–12+ years of hands-on experience in embedded software, physical hardware prototyping, digital signal processing, and real-time edge computing.
• Strong C/C++ programming for constrained microcontrollers, bare-metal or RTOS, DMA, and low-level drivers (SPI, I2C, UART, CAN).
• Experience leading lab teams and mentoring junior engineers.

Responsibilities

• Lab Ownership & Technical Leadership: manage physical lab facilities, equipment, part procurement, and project scheduling for customer PoCs, internal R&D, and cross-BU hardware integrations.
• Physical Prototyping & Fabrication: lead hands-on assembly of prototype rigs, sensor arrays, 3D-printed mounts, and microelectronic setups to capture real-world physical data.
• High-Frequency Sensor Data Engineering: instrument physical systems to capture, clean, and preprocess high-frequency time-series datasets (acoustic, vibration, electrical, motor current).
• DSP & TinyML Deployment: design DSP feature extraction pipelines (FFTs, spectral analysis, filtering) and deploy optimized, quantized TinyML models onto microcontrollers (ARM Cortex-M, Renesas RA/RX/RL78) using TFLite Micro, CMSIS-NN, or eIQ.
• Customer & Cross-BU Collaboration: work directly with customers and internal product teams to ingest raw hardware telemetry, debug edge firmware issues, and demonstrate live hardware solutions.
• Team Mentorship: Lead, mentor, and guide junior lab engineers in firmware debugging, signal processing, and physical prototype fabrication.

Skills

C/C++ embedded firmware

DSP

TinyML deployment

Lab leadership

Physical prototyping

Hardware debugging

Education

M.S./Ph.D. in Electrical/Computer Engineering or Applied Physics

BSEE with lab leadership experience

Tools

Oscilloscopes

Logic analyzers

JTAG/SWD

Job description

Renesas Electronics in Columbia, MD is seeking a Senior Staff Edge Applications Engineer to lead our physical Edge AI lab. You will head the lab, drive PoCs, mentor junior engineers, and engineer end-to-end non-visual sensing solutions on Renesas silicon using TinyML on microcontrollers.

You'll work at the intersection of DSP, embedded firmware, and physical prototyping, shipping hardware solutions to automotive, industrial, and IoT markets. Strong leadership and hands-on skills are essential.