Senior ECAD Designer: PCB Layout, Schematics & Release

TEEMA; Dallas (TX); On-site; USD 85,000 - 120,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

HSA

401(k) with company match

Paid vacation

Paid holidays

Job summary

TEEMA client seeks an experienced ECAD Designer to develop new electronic products and support existing designs. You’ll create schematics, design PCB layouts, manage ECAD libraries, and prepare manufacturing documentation.

You’ll collaborate with electrical, mechanical, manufacturing and test engineers through design, prototype, validation and production, ensuring signal integrity, EMI/EMC and manufacturability.

Qualifications

• 5+ years of ECAD design experience.
• Strong experience with schematic capture and PCB layout.
• Proficiency in OrCAD Capture and PADS Professional / PADS Layout.
• Understanding of PCB fabrication and assembly processes.
• Knowledge of IPC standards and DFM, DFA, and DFT principles.

Responsibilities

• Create and update electronic schematics using OrCAD Capture and Altium Designer.
• Design complex multilayer PCBs for analog, digital, mixed-signal, and power applications.
• Convert legacy PADS and OrCAD designs into Altium Designer.
• Create and maintain ECAD libraries, including symbols, footprints, 3D models, and component data.
• Develop PCB stackups with consideration for signal integrity, power integrity, EMI/EMC, thermal performance, and manufacturability.

Skills

ECAD design

Schematic capture

PCB layout

Education

Bachelor's degree in Electrical Engineering or related field

Tools

OrCAD Capture

PADS Professional

PADS Layout

Job description

TEEMA client seeks an experienced ECAD Designer to develop new electronic products and support existing designs. You’ll create schematics, design PCB layouts, manage ECAD libraries, and prepare manufacturing documentation.

You’ll collaborate with electrical, mechanical, manufacturing and test engineers through design, prototype, validation and production, ensuring signal integrity, EMI/EMC and manufacturability.