Senior Digital Physical Implementation & Integration Engineer

Micron Technology, Inc; San Jose (CA); On-site; USD 145,000 - 246,000; Full time

Benefits offered by this job

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. is seeking a Digital Physical Implementation and Integration Engineer to own the top‑level integration and physical layout of large digital designs in NAND products.

You will drive synthesis handoff, floorplanning, place‑and‑route, and timing/DRC/LVS closure with a global design team. You will collaborate across groups—Product Engineering, Test, Process Integration, and Marketing—to ensure manufacturability, quality, reliability, and timely delivery while advancing memory

Qualifications

• Bachelor’s degree in Computer or Electrical Engineering.
• 5+ years of digital physical design, with at least one full tapeout.
• Strong static timing analysis and debug skills across multi‑corner scenarios.
• Experience with top‑level digital integration flows and full‑chip or large partition designs.

Responsibilities

• Own physical implementation and top‑level integration of large digital designs in NAND products.
• Drive floorplanning, placement, routing, timing closure, and DRC/LVS for masks and tapesouts.
• Collaborate with Product Engineering, Test, Process Integration, and Marketing to optimize manufacturability and cost.
• Automate flows in Tcl/Python/Perl and mentor engineers in design methodology.

Skills

Digital physical design

Layout optimization

Synthesis (Innovus/ICC2)

Timing analysis (PrimeTime)

Scripting (Tcl, Python, Perl)

Linux/Unix

Git

Calibre (DRC/LVS)

Education

Bachelor’s degree in Computer or Electrical Engineering

Tools

Cadence Innovus

Synopsys ICC2

Cadence Genus

Cadence Design Compiler

Calibre

PrimeTime

Job description

Micron Technology, Inc. is seeking a Digital Physical Implementation and Integration Engineer to own the top‑level integration and physical layout of large digital designs in NAND products.

You will drive synthesis handoff, floorplanning, place‑and‑route, and timing/DRC/LVS closure with a global design team. You will collaborate across groups—Product Engineering, Test, Process Integration, and Marketing—to ensure manufacturability, quality, reliability, and timely delivery while advancing memory