Senior Connectivity Architect for Data Center SoCs

Qualcomm

San Diego (CA)

On-site

USD 192,000 - 288,000

Full time

14 days+
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Job summary

Qualcomm Technologies, Inc. seeks an experienced Connectivity Project Engineer, Principal to lead high-performance SoC development for data center applications. You will guide concept to commercialization, coordinating across engineering teams and ensuring IP design quality and power efficiency.

The role requires deep semiconductor architecture knowledge, leadership, and strong cross-functional communication to drive on-time, within-budget delivery of complex chipset projects.

Qualifications

  • Bachelor's degree in Science, Engineering, or related field and 8+ years of ASIC design/verification experience.
  • Master's degree in Science, Engineering, or related field and 7+ years of ASIC design/verification experience.
  • PhD in Science, Engineering, or related field and 6+ years of ASIC design/verification experience.

Responsibilities

  • Oversee chipset development and ensure KPIs (PPA, schedule, cost) are met.
  • Drive resolution of engineering issues within the chipset and across blocks.
  • Identify risks and mitigate them.
  • Influence development of new methodologies to meet KPIs.
  • Communicate project status to senior management.

Skills

Semiconductor design
High-performance SoCs
Technical leadership
Communication
SerDes/IP design
System architecture

Education

Bachelor's degree in Science/Engineering
Master's degree in Science/Engineering
PhD in Science/Engineering

Tools

Verilog/SystemVerilog

Job description

Qualcomm Technologies, Inc. seeks an experienced Connectivity Project Engineer, Principal to lead high-performance SoC development for data center applications. You will guide concept to commercialization, coordinating across engineering teams and ensuring IP design quality and power efficiency.

The role requires deep semiconductor architecture knowledge, leadership, and strong cross-functional communication to drive on-time, within-budget delivery of complex chipset projects.

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