Senior AI & Modeling Engineer — VSM & Multiscale

Micron; Boise (ID); On-site; USD 120,000 - 160,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off

Equal opportunity employer

Job summary

Micron Technology in Boise, ID is seeking a Senior Engineer to advance VSM, CM, and DT modeling across wafer, die and package levels. You will collaborate with global teams to deploy advanced modeling solutions using ML/AI techniques and communicate insights to engineering leadership.

The role requires a Master’s degree with 3+ years (or PhD with 1+ year) in a related field, strong programming (C++, Python) and experience with Linux, cloud platforms, and high‑performance computing.

Qualifications

• Master’s degree with 3+ years or PhD with 1+ years or equivalent experience in Engineering, Applied Sciences, Computer Science, Computer Engineering, Chemical Engineering, Electrical Engineering, or a related field.
• Strong understanding of Numerical Methods, High Performance Computing, Machine Learning, and Artificial Intelligence algorithms.
• Experience in innovative Multiphysics and Multiscale modeling methods and ML/DL/AI libraries working with high-dimensional and dynamic datasets.
• Proficiency in Linux, C++, Python, and experience working in Cloud or HPC environments.
• Familiarity with SQL, data engineering, and various cloud platforms (Azure, GCP, AWS).
• Exposure to semiconductor technologies or manufacturing.

Responsibilities

• Develop VSM/CM/DT of wafer, die, and package level models across tech nodes.
• Collaborate with global teams to develop and deploy advanced modeling solutions that accelerate design, technology, and product development.
• Apply a diverse range of computational, generative AI, Agentic AI techniques to build robust models with sparse datasets.
• Identify insights from VSM and data, and efficiently communicate findings to engineering teams and senior leaders.

Skills

Numerical methods

High performance computing

Machine learning

AI algorithms

C++

Python

Linux

SQL

Cloud platforms

Education

Master’s degree in Engineering or related field

PhD in Engineering or related field

Tools

Cloud platforms (Azure/AWS/GCP)

High-performance computing tools

Job description

Micron Technology in Boise, ID is seeking a Senior Engineer to advance VSM, CM, and DT modeling across wafer, die and package levels. You will collaborate with global teams to deploy advanced modeling solutions using ML/AI techniques and communicate insights to engineering leadership.

The role requires a Master’s degree with 3+ years (or PhD with 1+ year) in a related field, strong programming (C++, Python) and experience with Linux, cloud platforms, and high‑performance computing.