Senior AI Modeling Engineer – VSM & Multiphysics

Micron Technology, Inc; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical/Dental/Vision plans

Paid time off

Paid holidays

Retirement benefits

Job summary

Micron Technology, Inc. in Boise, ID is seeking a Senior Engineer to advance VSM, CM, and DT modeling across wafer, die, and package levels. You will collaborate globally to deploy advanced modeling that accelerates design, technology, and product development while applying generative AI techniques to data-rich insights.

The role requires mastery of numerical methods, HPC, ML/AI, Linux, C++, Python, and cloud/HPC experience, with exposure to semiconductor manufacturing. Relocation TBD.

Qualifications

• Master’s degree with 3+ years or PhD with 1+ years or equivalent experience in Engineering, Applied Sciences, Computer Science, Computer Engineering, Chemical Engineering, Electrical Engineering, or a related field.
• Strong understanding of Numerical Methods, High Performance Computing, Machine Learning, and Artificial Intelligence algorithms.
• Experience in innovative Multiphysics and Multiscale modeling methods and ML/DL/AI libraries working with high-dimensional and dynamic datasets.
• Proficiency in Linux, C++, Python, and experience working in Cloud or HPC environments.
• Familiarity with SQL, data engineering, and various cloud platforms (Azure, GCP, AWS).
• Exposure to semiconductor technologies or manufacturing.

Responsibilities

• Develop VSM/CM/DT of wafer, die, and package level models across tech nodes.
• Collaborate with global teams to develop and deploy advanced modeling solutions that accelerate design, technology, and product development.
• Apply a diverse range of computational, generative AI, Agentic AI techniques to build robust models with sparse datasets.
• Identify insights from VSM and data, and efficiently communicate findings to engineering teams and senior leaders.

Skills

Numerical methods

High performance computing

Machine learning

AI algorithms

Multiphysics modeling

Multiscale modeling

ML libraries

DL libraries

Linux

C++

Python

SQL

Data engineering

Cloud platforms

Education

Master’s degree or PhD

Tools

SQL

Data engineering

Cloud platforms

Job description

Micron Technology, Inc. in Boise, ID is seeking a Senior Engineer to advance VSM, CM, and DT modeling across wafer, die, and package levels. You will collaborate globally to deploy advanced modeling that accelerates design, technology, and product development while applying generative AI techniques to data-rich insights.

The role requires mastery of numerical methods, HPC, ML/AI, Linux, C++, Python, and cloud/HPC experience, with exposure to semiconductor manufacturing. Relocation TBD.